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Systematic study on the mechanical and electric behaviors of the nonbuckling interconnect design of stretchable electronics 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61, 期号: 11, 页码: 114611
作者:  Liu H;  Xue RY;  Hu JQ(胡剑桥);  Ping XC;  Wu HP
收藏  |  浏览/下载：77/0  |  提交时间：2018/10/30
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian
收藏  |  浏览/下载：33/0  |  提交时间：2018/12/28
System Dynamics Modeling and Simulation for Global Energy-Economy-Politics System 会议论文
IEEE Conference on Energy Internet and Energy System Integration (EI2), NOV 26-28, 2017
作者:  Han, Linxiao;  Zhang, Hengxu;  Zhang, Yong;  Zhang, Lei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel 会议论文
Montréal, Quebec, Canada, 2014-6-22
Shouwei Hu; Yi Chen
收藏  |  浏览/下载：27/0  |  提交时间：2015/03/12
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
A Numerical Method for Modeling the Effects of Irregular Shape on Interconnect Resistance 期刊论文
CHINESE PHYSICS LETTERS, 2014, 卷号: 31
作者:  Chen Bao-Jun;  Tang Zhen-An;  Ju Yan-Jie
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
RWCap: A Floating Random Walk Solver for 3-D Capacitance Extraction of Very-Large-Scale Integration Interconnects 期刊论文
ieee transactions on computer aided design of integrated circuits and systems, 2013
Yu, Wenjian; Zhuang, Hao; Zhang, Chao; Hu, Gang; Liu, Zhi
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/11
Realization of a modeling and simulation system for MID laser direct structuring equipment 其他
2013-01-01
Hu, Wen Juan; Zhuo, Yong; Wu, Xuan; Lan, Guo Wei; Zhao, Xin; 卓勇
收藏  |  浏览/下载：3/0  |  提交时间：2015/07/22
Structure Optimization of Through Silicon Via (TSV) Interconnect as Transmission Channel for 3D Integration 会议论文
2013 5TH IEEE INTERNATIONAL SYMPOSIUM ON MICROWAVE, ANTENNA, PROPAGATION AND EMC TECHNOLOGIES FOR WIRELESS COMMUNICATIONS (MAPE), 2013-01-01
作者:  Rahman, Toyobur;  Yan, Zhaowen;  Miao, Jungang;  Youcef, Hacene
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06
THE INVESTIGATION OF 3D EMBEDDED MICROCHANNEL NETWORKS FOR 3D IC COOLING, VACUUM PACKAGING AND THZ PASSIVE DEVICE APPLICATIONS 其他
2012-01-01
Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16

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