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Thermoelectric Properties of Mg
3
(Bi,Sb)
2
under Finite Temperatures and Pressures: A First-Principles Study
期刊论文
NANOMATERIALS, 2024, 卷号: 14, 期号: 1, 页码: 17
作者:
Peng Q(彭庆)
;
Ma, Xinjie
;
Yang, Xiaoyu
;
Yuan XZ(袁晓泽)
;
Chen, XiaoJia
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2024/02/19
thermoelectric materials
PBE-D3
vdW-DFq
first-principles calculation
Mg3Bi2-vSbv
MatCloud
Assessing Effects of van der Waals Corrections on Elasticity of Mg
3
Bi
2-x
Sb
x
in DFT Calculations
期刊论文
MATERIALS, 2023, 卷号: 16, 期号: 19, 页码: 15
作者:
Peng, Qing
;
Ma, Xinjie
;
Yang, Xiaoyu
;
Zhao, Shuai
;
Yuan, Xiaoze
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2023/11/13
thermoelectric materials
PBE-D3
vdW-DFq
first-principles calculation
Mg3Bi2-xSbx
Synergistic defect engineering for improving n-type NbFeSb thermoelectric performance through high-throughput computations
期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2022, 卷号: 10
作者:
Li, Jingyu
;
Zhu, Jianbo
;
Ti, Zhuoyang
;
Zhai, Wenya
;
Wei, Liuming
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/12/23
Achieving higher thermoelectric performance of n-type PbTe by adjusting the band structure and enhanced phonon scattering
期刊论文
NANOSCALE, 2022
作者:
Wu, Wei
;
Zhu, Chen
;
Ming, Hongwei
;
Chen, Tao
;
Li, Di
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/12/23
Thermoelectric properties of hole-doped CuRhO2 thin films
期刊论文
APPLIED PHYSICS LETTERS, 2022, 卷号: 121
作者:
Cheng, W. P.
;
He, Y. D.
;
Wei, R. H.
;
Hu, L.
;
Song, W. H.
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/12/23
High Thermoelectric Performance of Cu3SbSe4 Obtained by Synergistic Modulation of Power Factor and Thermal Conductivity
期刊论文
ACS APPLIED ENERGY MATERIALS, 2022
作者:
Ai, Li
;
Ming, Hongwei
;
Chen, Tao
;
Chen, Ke
;
Zhang, Jinhua
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/12/22
thermoelectric performance
Cu3SbSe4
electrical resistivity
thermal conductivity
density of state
figure of merit
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Influence mechanism of thermoelectric coupling on microstructure of aluminum/steel continuous drive friction welding joints
期刊论文
Cailiao Gongcheng/Journal of Materials Engineering, 2022, 卷号: 50, 期号: 5, 页码: 35-42
作者:
Zhang, Changqing
;
Wang, Shuwen
;
Luo, Dechun
;
Shi, Wenchen
;
Liu, Xiao
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2022/06/20
Crack tips
Dissimilar metals
Failure analysis
Friction
Growth rate
Low carbon steel
Aluminum steel
Aluminum/steel dissimilar joint
Continuous drive friction welding
Dissimilar joints
Intermetallic compound layer
Intermetallics compounds
Joint interfaces
Tensile fractures
Thermoelectric
Thermoelectric coupling
Low thermal conductivity and high thermoelectric performance via Cd underbonding in half-Heusler PCdNa
期刊论文
PHYSICAL REVIEW B, 2022, 卷号: 105
作者:
Ye, Xianfeng
;
Feng, Zhenzhen
;
Zhang, Yongsheng
;
Zhao, Gaofeng
;
Singh, David J.
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/12/23
High Thermoelectric Performance of CaMg2Bi2 Enabled by Dynamic Doping and Orbital Alignment
期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2022
作者:
Guo, Muchun
;
Zhai, Wenya
;
Li, Jingyu
;
Zhu, Jianbo
;
Guo, Fengkai
收藏
  |  
浏览/下载:75/0
  |  
提交时间:2022/03/28
dynamic doping
optimal carrier concentration
orbital alignment
thermoelectric CaMg
Bi-2
(2)
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