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兰州化学物理研究所 [13]

兰州理工大学 [5]

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西安交通大学 [1]

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	Ultraductile waterborne epoxy-concrete composite repair material: Epoxy-fiber synergistic effect on flexural and tensile performance 期刊论文 Cement and Concrete Composites, 2022, 卷号: 129 作者: Pang, Bo; Jin, Zuquan; Zhang, Yunsheng; Xu, Lei; Li, Mengyuan 收藏 \| 浏览/下载：32/0 \| 提交时间：2022/04/21 Brittleness Cements Compressive strength Deterioration Epoxy resins Fiber bonding Fibers Fracture mechanics Plasticity Reinforced concrete Repair Tensile strain Tensile strength Cement concrete Composite repair Concrete composites Epoxy Flexural performance Repair materials Service time Synergistic effect Tensile performance Waterborne epoxy
	The interpenetration polymer network in a cement paste–waterborne epoxy system 期刊论文 Cement and Concrete Research, 2021, 卷号: 139 作者: Pang, Bo; Jia, Yantao; Pang, Sze Dai; Zhang, Yunsheng; Du, Hongjian 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/03/02 Calcium silicate Composite structures Epoxy resins Molecular dynamics Textures Cement based composites Cement based material Degree of polymerization Interaction parameters Interpenetrating polymer network (IPN) Performance prediction Water-borne epoxy resins Water-to-cement ratios
	The interpenetration polymer network in a cement paste-waterborne epoxy system 期刊论文 CEMENT AND CONCRETE RESEARCH, 2021, 卷号: 139, 页码: - 作者: Pang, Bo; Jia, Yantao; Pang, Sze Dai; Zhang, Yunsheng; Du, Hongjian 收藏 \| 浏览/下载：16/0 \| 提交时间：2021/03/12 C-S-H CALCIUM-SILICATE-HYDRATE MECHANICAL-PROPERTIES PORTLAND-CEMENT DENSITY DYNAMICS MODEL FIELD NANOINDENTATION PERFORMANCE
	The interpenetration polymer network in a cement paste–waterborne epoxy system 会议论文作者: Pang, Bo; Jia, Yantao; Pang, Sze Dai; Zhang, Yunsheng; Du, Hongjian 收藏 \| 浏览/下载：10/0 \| 提交时间：2020/12/18 Calcium silicate Composite structures Epoxy resins Molecular dynamics TexturesCement based composites Cement based material Degree of polymerization Interaction parameters Interpenetrating polymer network (IPN) Performance prediction Water-borne epoxy resins Water-to-cement ratios
	The interpenetration polymer network in a cement paste–waterborne epoxy system 期刊论文 Cement and Concrete Research, 2021, 卷号: 139 作者: Pang, Bo; Jia, Yantao; Pang, Sze Dai; Zhang, Yunsheng; Du, Hongjian 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Calcium silicate Composite structures Epoxy resins Molecular dynamics Textures Cement based composites Cement based material Degree of polymerization Interaction parameters Interpenetrating polymer network (IPN) Performance prediction Water-borne epoxy resins Water-to-cement ratios
	Design of network Al2O3 spheres for significantly enhanced thermal conductivity of polymer composites 期刊论文 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2020, 卷号: 128, 页码: 8 作者: Ouyang, Yuge; Ding, Fei; Bai, Liuyang; Li, Xiaofei; Hou, Guolin 收藏 \| 浏览/下载：32/0 \| 提交时间：2020/03/24 Polymer-matrix composites (PMCs) Hybrid Thermal properties Heat treatment
	Silicone-Epoxy-Based Hybrid Photopolymers for 3D Printing 期刊论文 MACROMOLECULAR CHEMISTRY AND PHYSICS, 2018, 卷号: 219, 期号: 10 作者: Zhao, Tingting; Li, Xinpan 收藏 \| 浏览/下载：39/0 \| 提交时间：2019/04/09 3d Printing Acrylate Hybrid Photopolymers Silicone-epoxy Stereolithography
	Epoxy resins toughened with in situ azide-alkyne polymerized polysulfones 期刊论文 JOURNAL OF APPLIED POLYMER SCIENCE, 2018, 卷号: 135, 期号: 5, 页码: - 作者: Ko, Na Yeong; Lee, Min Woo; Moon, Da Som; Yang, Hee Sang; Zhu, Jin 收藏 \| 浏览/下载：42/0 \| 提交时间：2018/12/04 Engineering Thermoplastics Chemical-modification Mechanical-properties Fracture-toughness Click Chemistry Morphology Networks Improvement Composites Copolymer
	Physical Properties of Micro Hollow Glass Bead Filled Castor Oil-Based Polyurethane/Epoxy Resin IPN Composites 期刊论文 Journal of Macromolecular Science Part B Physics, 2017, 卷号: 56, 期号: 3, 页码: 161-169 作者: Chen SB(陈守兵); Zhang XR(张新瑞); Wang QH(王齐华); Wang TM(王廷梅) 收藏 \| 浏览/下载：22/0 \| 提交时间：2017/04/07 Damping properties hollow glass beads interpenetrating polymer network mechanical properties
	Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者: Yankang Han; Baotan Zhang; Pengli Zhu; Shulei Huang; Rong Sun 收藏 \| 浏览/下载：23/0 \| 提交时间：2017/01/15

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