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CORC

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High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：18/0  |  提交时间：2021/11/22
A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文
MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  An, Xizhong
收藏  |  浏览/下载：61/0  |  提交时间：2021/10/15
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：48/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：44/0  |  提交时间：2021/02/02
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：18/0  |  提交时间：2021/02/03
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：18/0  |  提交时间：2022/03/01
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin
收藏  |  浏览/下载：19/0  |  提交时间：2019/11/15
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：27/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：44/0  |  提交时间：2021/02/02

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