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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:
Chen, Yinbo
;
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2021/03/15
Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65
作者:
Cai, T.
;
Li, K. Q.
;
Zhang, Z. J.
;
Zhang, P.
;
Liu, R.
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2021/02/02
Cu-alloy
Deformation behavior
First-principles calculation
Stacking fault energy
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders
期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:
Lin, Qiaoli
;
Ye, Changsheng
;
Sui, Ran
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Amorphous alloys
Binary alloys
Copper alloys
Lead alloys
Nickel oxide
Oxide films
Silver alloys
Ternary alloys
Tin
Crystalline alloys
Interfacial reactivity
Minimum surfaces
Primary crystallization
Sn-based solders
Volume shrinkage
Wetting balance methods
Wetting mechanism
Wetting Behavior of Molten SnAgCu-xTi on SiO2 Surface Under High Temperature
期刊论文
Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 5, 页码: 10114-10119
作者:
Wang, Jianbin
;
Lin, Qiaoli
;
Sui, Ran
;
Ci, Wenjuan
;
Ye, Changsheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Dissolution
Reaction products
Silica
Silicon
Wetting
Adsorption at interfaces
High melting point
High temperature
Liquid/solid interface
Modified sessile drop method
Product control
Spreading dynamics
Wetting behavior
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
收藏
  |  
浏览/下载:129/0
  |  
提交时间:2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:
Li, Qi-hai
;
Li, Cai-Fu
;
Zhang, Wei
;
Chen, Wei-wei
;
Liu, Zhi-Qua
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2021/02/02
62Sn36Pb2Ag solder joint
Microstructural evolution
Failure analysis
Intermetallic compound (IMC)
Thermal cycling
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:
Li, Qi-hai
;
Li, Cai-Fu
;
Zhang, Wei
;
Chen, Wei-wei
;
Liu, Zhi-Qua
收藏
  |  
浏览/下载:43/0
  |  
提交时间:2021/02/02
62Sn36Pb2Ag solder joint
Microstructural evolution
Failure analysis
Intermetallic compound (IMC)
Thermal cycling
Reactive wetting of amorphous silica by Sn0.3Ag0.7Cu-xTi (x = 1 and 3wt.%)alloys at 800–900°C
期刊论文
Ceramics International, 2019, 卷号: 45, 期号: 10, 页码: 12920-12925
作者:
Sui, Ran
;
Wang, Jianbin
;
Ci, Wenjuan
;
Lin, Qiaoli
;
Yang, Hongyu
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2020/11/14
Dissolution
Interfaces (materials)
Joining
Oxides
Reaction products
Silica
Silicon
Wetting
Adsorption at interfaces
Amorphous silica
High melting point
Liquid/solid interface
Modified sessile drop method
Product control
Reactive wetting
Spreading dynamics
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