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CORC

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Responsivity improvement of a packaged ZnMgO solar blind ultraviolet photodetector via a sealing treatment of silica gel 期刊论文
Journal of Materials Chemistry C, 2020, 卷号: 8, 期号: 3, 页码: 1089-1094
作者:  X. Chen,L. Y. Wang,K. W. Liu,Z. Z. Zhang,B. H. Li,J. B. Wu,J. Y. Wang,Y. X. Ni and D. Z. Shen
收藏  |  浏览/下载：3/0  |  提交时间：2021/07/06
Preparation of highly conductive silver nanowires for electrically conductive adhesives 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 15786-15794
作者:  Lu, Jing;  Liu, Di;  Dai, Junfu
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Electrical and mechanical properties of CNT/CB dual filler conductive adhesives (DFCAs) for automotive multi-material joints 期刊论文
COMPOSITE STRUCTURES, 2019, 卷号: 225
作者:  Zhang, Cheng;  Sun, Lingyu;  Huang, Bincheng;  Yang, Xudong;  Chu, Yantao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Application of Ag/graphene composites in flexible electrical conductive adhesives 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Hongru;  Yan, Shaocun;  Li, Zhe;  Ma, Yanqing;  Ma, Lei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Highly conductive, flexible PU/PANI based conductive adhesives for flexible electronics 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yan, Shaocun;  Ma, Hongru;  Li, Zhe;  Ma, Yanqing;  Ma, Lei
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Thermally Conductive General-Purpose Polystyrene (GPPS)/Graphite Composite with a Segregated Structure: Effect of Size of Resin and Graphite Flakes 期刊论文
Polymer-Plastics Technology and Engineering, 2018, 卷号: Vol.57 No.13, 页码: 1277-1287
作者:  Chuanwei Gao;  Changping Feng;  Hui Lu;  Haiying Ni;  Jun Chen
收藏  |  浏览/下载：6/0  |  提交时间：2019/02/25
Application of Ag/graphene composites in flexible electrical conductive adhesives 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, August 8, 2018 - August 11, 2018
作者:  Ma, Hongru;  Yan, Shaocun;  Li, Zhe;  Ma, Yanqing;  Ma, Lei
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31
A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials 会议论文
Harbin, China
作者:  Jia-Hui Kang;  Jia-Li Sheng;  Xian-Zhu Fu;  Rong Sun;  Ching-Ping Wong
收藏  |  浏览/下载：15/0  |  提交时间：2018/02/02
In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2017
作者:  Li, Chaowei（李朝威）;  Li, Qiulong;  Long, Xiaoyang;  Li, Taotao;  Zhao, Jingxin
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/05
Epoxy‐based adhesives filled with flakes ag‐coated copper as conductive fillers 期刊论文
Polymer Composites, 2017, 卷号: 38, 期号: 5, 页码: 846-851
作者:  Zhao, Jun*;  Zhang, Dongming
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04

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