CORC

在结果中检索

CORC

浏览/检索结果: 共88条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
作者:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.
收藏  |  浏览/下载：24/0  |  提交时间：2022/09/16
Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
作者:  Wang, Qian;  Nie, Yong;  Shao, Yingfeng;  Liu, Hongzhi;  Hu, Xiaoqiang
收藏  |  浏览/下载：12/0  |  提交时间：2022/07/01
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：266/0  |  提交时间：2021/10/15
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/02
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili
收藏  |  浏览/下载：18/0  |  提交时间：2021/02/02
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345
作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping
收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Understanding the electrochemical behavior of bulk-synthesized MgZn2 intermetallic compound in aqueous NaCl solutions as a function of pH 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2019, 卷号: 23, 期号: 4, 页码: 1165-1177
作者:  Ikeuba, Alexander I.;  Kou, Fujun;  Duan, Haowei;  Zhang, Bo;  Wang, Jianqiu
收藏  |  浏览/下载：54/0  |  提交时间：2021/02/02

©版权所有 ©2017 CSpace - Powered by CSpace