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金属研究所 [6]
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期刊论文 [6]
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Effect of work hardening discrepancy on strengthening of laminated Cu/CuZn alloys
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2022, 卷号: 103, 页码: 67-72
作者:
Cao, Zheng
;
Cheng, Zhao
;
Xu, Wei
;
Lu, Lei
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/07/14
Laminated Cu
Cu alloys
Work hardening
Strengthening
Interfacial affected zone
Strain localization
Selection and mechanical evaluation of gamma/gamma boundary in gamma-TiAl alloy
期刊论文
INTERMETALLICS, 2020, 卷号: 126, 页码: 11
作者:
Zhang, Jinhu
;
Teng, Chunyu
;
Meng, Zhichao
;
Xu, Haisheng
;
Yang, Liang
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2021/02/02
Titanium alloy
Elastic strain energy
Interfacial energy difference
gamma/gamma boundary
Phase field model
Molecular dynamics method
Simulations of deformation and damage processes of SiCp/Al composites during tension
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 4, 页码: 627-634
作者:
Zhang, JF
;
Zhang, XX
;
Wang, QZ
;
Xiao, BL
;
Ma, ZY
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  |  
浏览/下载:26/0
  |  
提交时间:2018/06/05
Metal-matrix Composites
Strain-gradient-plasticity
Particle-size
Mechanical-properties
Silicon-carbide
Representative Volume
Interfacial Strength
Conventional Theory
Hybrid Composites
Fracture
Effect of crystallographic orientation and grain boundary character on fatigue cracking behaviors of coaxial copper bicrystals
期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 425-438
L. L. Li
;
P. Zhang
;
Z. J. Zhang
;
Z. F. Zhang
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  |  
浏览/下载:20/0
  |  
提交时间:2013/12/24
Copper bicrystal
Interfacial energy
Crystallographic orientation
Grain boundary
Twin boundary
cyclic deformation-behavior
persistent slip bands
structure-energy
correlation
centered-cubic metals
stage-i propagation
high strain
fatigue
low-alloy steel
transfer mechanisms
single-crystals
twin
boundaries
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints
期刊论文
Microelectronic Engineering, 2010, 卷号: 87, 期号: 4, 页码: 601-609
H. F. Zou
;
Z. F. Zhang
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  |  
浏览/下载:13/0
  |  
提交时间:2012/04/13
Sn-Cu solder
Interfacial strength
Intermetallic compounds
Ductile-to-brittle transition
Strain rate
Fracture
lead-free solders
intermetallic compounds
tensile properties
microstructure
growth
alloy
Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times
期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861
Q. K. Zhang
;
Z. F. Zhang
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  |  
浏览/下载:20/0
  |  
提交时间:2012/04/13
Sn-4Ag solder
Interfacial IMCs
Tensile properties
Strain rate
Fracture mechanism
lead-free solders
sn-ag
shear-strength
tensile properties
intermetallic compound
deformation-behavior
strain-rate
interfacial
reaction
cu substrate
microstructure
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