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CORC

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Impurity effects on ion temperature gradient driven multiple modes in transport barriers 期刊论文
NUCLEAR FUSION, 2019, 卷号: 59
作者:  Li, J.;  Wang, Z. X.;  Dong, J. Q.;  Han, M. K.;  Shen, Y.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of temperature gradient on the diffusion layer thickness of impurities during directional solidification process 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 74, 页码: 102-108
作者:  Ren, Shiqiang;  Tan, Yi;  Jiang, Dachuan;  Li, Pengting;  Li, Jiayan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 1436-1443
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Multiple ion temperature gradient driven modes in transport barriers 期刊论文
NUCLEAR FUSION, 2017, 卷号: 57
作者:  Han, M. K.;  Wang, Zheng-Xiong;  Dong, J. Q.;  Du, Huarong
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Inverse analysis for simultaneously estimating multi-parameters of temperature-dependent thermal conductivities of an Inconel in a reusable metallic thermal protection system 期刊论文
APPLIED THERMAL ENGINEERING, 2017, 卷号: 125, 页码: 480-488
作者:  Cui, Miao;  Zhao, Yi;  Xu, Bing-bing;  Wang, Shengdong;  Gao, Xiao-wei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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