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西安交通大学 [3]

力学研究所 [2]

清华大学 [1]

华南理工大学 [1]

武汉大学 [1]

中南林业科技大学 [1]

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会议论文 [9]

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	Role of inhomogeneous intrinsic point defect distribution on electrical properties in ZnO varistor ceramics 会议论文作者: Huang, Yuwei; Wu, Kangning; Tang, Zhuang; Xin, Lei; Li, Jianying 收藏 \| 浏览/下载：14/0 \| 提交时间：2019/11/19 Boundary characteristics Electrical performance Grain size distribution Intrinsic point defects Nonlinear coefficient Schottky barrier heights Thermally stimulated depolarization currents ZnO Varistor Ceramics
	A Statistical Approach for Effectively Analyzing the Grain Size Distribution Along the Thickness Direction in Commercial ZnO-Based Varistor Ceramics 会议论文作者: Zhang, Lei; Yu, Chuan; Zhang, Le; Liu, Wenfeng; Wu, Kangning 收藏 \| 浏览/下载：11/0 \| 提交时间：2019/11/26 Grain-grain boundaries Grain growth mechanisms Grain size distribution Log-normal distribution Macroscopic properties Probability plot Quantitative information Zno-based varistor ceramics
	Enhanced breakdown field of xSrCu3Ti4O12/(1- x)CaCu3Ti4O12composite ceramics 会议论文作者: Tang, Zhuang; Huang, Yuwei; Wu, Kangning; Li, Jianying 收藏 \| 浏览/下载：8/0 \| 提交时间：2019/11/26 Average grain size Breakdown field CCTO ceramics Donor density Grain size distribution Schottky barriers Sintering condition Solid state method
	A micromechanical model for deformation behavior of nanocrystalline copper 会议论文 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, China, NOV 06-08, 2010 作者: Lan JX(兰姣霞); Wu YZ(吴永中); Hong YS(洪友士); Lan JX 收藏 \| 浏览/下载：18/0 \| 提交时间：2013/02/26 Algorithms Copper Deformation Grain boundaries Grain size and shape Materials Micromechanics Molecular dynamics Strain energy Deformation behavior Deformation mechanism Developed model Experimental values Grain shapes Grain size Internal variable theory Iteration algorithms Micromechanical model Molecular dynamics simulations Nanocrystalline copper Nanocrystallines Pure copper Statistical distribution Stress strain relation Uniaxial tensions
	Distribution of the molecule weight and grain size of medium temperature phenol formaldehyde resin 会议论文 2011 First International Conference on High Performance Structures and Materials Engineering (ICHPSM 2011), 中国北京, 2011-05-05 作者: Jian, Han*; Guo, Yie 收藏 \| 浏览/下载：11/0 \| 提交时间：2019/12/28 MTPF LC-MS distribution of molecule weight grain size
	On the grain size distribution of MnO doped ZnO ceramics 会议论文 High-Performance Ceramics IV, Pts 1-3, 4th China International Conference on High-Performance Ceramics (CICC-4), Chengdu, PEOPLES R CHINA, Web of Science Li, Shuai; Liu, Danian; Gong, Jianghong 收藏 \| 浏览/下载：2/0 \| 提交时间：2017/06/15 grain growth grain size distribution grain morphology COMPUTER-SIMULATION GROWTH Materials Science, Ceramics Materials Science, Composites
	Investigation on micro-hardness with shear strain extent for copper specimens subjected to high pressure torsion 会议论文 International Conference on Experimental Mechanics 2008, ICEM 2008, Nanjing, China, November 8, 2008 - November 8, 2008 作者: Liu Y; Hong YS(洪友士); Fan KK; Ji XD 收藏 \| 浏览/下载：14/0 \| 提交时间：2017/07/14 Crystal particles Grain size Grain size refinement High pressure torsions Mechanical performance Metal materials Radius direction Saturation state Spatial distribution
	Research on the vertical distribution of the average grain-size of suspended load 会议论文作者: Zhang, HW; Tan, GM; Wei, ZL; Zhao, LJ 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/05 average grain-size suspended load vertical distribution silt stable
	A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者: Ke, Chang-Bo[1]; Zhou, Min-Bo[1]; Zhang, Xin-Ping[1] 收藏 \| 浏览/下载：1/0 \| 提交时间：2019/04/15 Diffusion Electronics packaging Grain boundaries Grain growth Growth kinetics Intermetallics Kinetics Morphology Phase interfaces Size distribution Soldering Soldering alloys

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