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华南理工大学 [22]
武汉大学 [4]
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北京航空航天大学 [2]
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会议论文 [37]
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The analysis about the application of nanomaterials in food packaging
会议论文
2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2018, Singapore, Singapore, 2018-09-14
作者:
Lizhao, Huang
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Nanostructured materials
Packaging machines, Food packaging
Nanometer material, Packaging materials
Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon
会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:
Li, T.
;
Yao, R.
;
Yu, C.
;
Su, F.
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
Cracks
Elasticity
Electronics packaging
Light polarization
Microscopes
Optical devices
Silicon carbide
Silicon wafers
Stresses
Wafer bonding
Wide band gap semiconductors
Electronic Packaging
Heating platform
Phase difference
Quarter wave-plate
Si-based materials
Silicon-based materials
Stress birefringence
Temperature cycling tests
Three dimensional integrated circuits
Fabrication of embedded piezoelectric sensors and its application in traffic engineering
会议论文
Singapore, Singapore, September 1, 2017 - September 3, 2017
作者:
Zhang, Xingjun
;
Song, Shanglin
;
Yao, Ming Jie
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/15
3D printers
Aggregates
Composite materials
Concrete aggregates
Concrete buildings
Concrete construction
Electric sensing devices
Epoxy resins
Glass ceramics
Highway engineering
Mean square error
Monitoring
Packaging materials
Piezoelectric ceramics
Piezoelectric devices
Piezoelectric transducers
Piezoelectricity
Structural health monitoring
Traffic control
Health monitoring
Piezoelectric sensors
Service performance
Traffic monitoring
Working performance
Dielectric properties of graphene-filled epoxy nanocomposite with enhanced thermal conductivity
会议论文
作者:
Li, He
;
Tian, Huidong
;
Cai, Mengchu
;
Gong, Ao
;
Zhou, Ziyu
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/11/26
Advanced dielectric materials
Application of polymers
Electronic Packaging
Enhanced thermal conductivity
Epoxy nanocomposites
Graphene nanosheets
High thermal conductivity
Thermo-gravimetric properties
Graphene-based Heat Spreading Materials for Electronics Packaging Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yuan, Guangjie[1]
;
Shan, Bo[2]
;
Chen, Shujing[3]
;
Yang, Yiqun[4]
;
Bao, Jie[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/24
heat spreading materials
graphene-based film
graphene-based electrically conductive adhesive
electronics packaging
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration
会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:
Liu, Huan
;
Zeng, Qinghua
;
Guan, Yong
;
Fang, Runiu
;
Sun, Xin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip scale packages
Electronics packaging
Failure (mechanical)
Fatigue of materials
Finite element method
Shear stress
Soldering
Stresses
Thermal load
Timing circuits
Global simulation
Interfacial failures
Load condition
Maximum principal stress
Resistance measurement
Solder balls
Thermal mechanical stress
Thermal-mechanical reliability
Three dimensional integrated circuits
The Potential Applications of W- and Mo-doped VO2 Nanobelts to the Functional Packaging Materials
会议论文
作者:
Zhang, Yifu
;
Fan, Meijuan
;
Huang, Chi
;
Liu, Xinghai
;
Liu, Xin
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/05
Nanomaterials
Functional packaging materials
VO2
Doped
Phase transition
Thermal modeling and analysis of high power semiconductor laser arrays
会议论文
作者:
Zhang, Zhiyong
;
Zhang, Pu
;
Li, Xiaoning
;
Xiong, Lingling
;
Liu, Hui
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/10
Diamond composite materials
High power semiconductor laser
Packaging structure
Quasi-continuous waves
Semiconductor laser arrays
Thermal Performance
Three dimensional thermal model
Transient thermal characteristics
Determination of Cadmium Content in the Food Paper and Plastic Packaging Materials with Wet Digestion-flame Atomic Absorption Spectrometry
会议论文
2012 International Conference on Biobase Material Science and Engineering, BMSE 2012, Changsha, China, October 21, 2012 - October 23, 2012
作者:
Peng Xiang-lian
;
Li Zhong-hai*
;
Qiang Dun-zhi
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/28
paper and plastic packaging materials
cadmium
wet digestion
flame atomic absorption spectrometry
An environmental friendly based research on the safety of food packing materials
会议论文
作者:
Gao, Zhiyong
;
Huang, Zengguang
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/05
green designing
green packaging
food packaging
packing materials
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