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Effects of elastic deformation and corrugation potential on friction of suspended graphene 会议论文
Phoenix, AZ, United states, November 11, 2016 - November 17, 2016
作者:  Dong, Yun;  Duan, Zaoqi;  Gueye, Birahima;  Cai, Shuang;  Zhang, Yan
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15
NEMS ACTUATOR DRIVEN BY ELECTROSTATIC AND OPTICAL FORCE WITH NANO-SCALE RESOLUTION 会议论文
作者:  Huang, J. G.;  Dong, B.;  Tang, M.;  Gu, Y. D.;  Wu, J. H.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
考虑Casimir力的静电激励NEMS尺寸效应研究 会议论文
中国力学大会-2015
作者:  梁斌斌;  张龙;  王炳雷;  周慎杰
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31
Experiments on the mechanical behavior of anodically bonded interlayer of Pyrex Glass/Al/Si 会议论文
Beijing, China, June 16, 2013 - June 21, 2013
作者:  Hu YQ;  Zhao YP(赵亚溥)
收藏  |  浏览/下载：17/0  |  提交时间：2018/11/08
Plasmonics for Thin Film Photovoltaic Devices Supporting by Oxide Coated Ag Nanoprisms Remote resonant actuation of microcantilever by modulated laser irradiation of one-nth the resonant frequency 会议论文
作者:  Zhaobin Feng;  Duo Liu
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
Patent Analysis and Technology Foresight on Micro/Nano Power Generation 会议论文
the 2nd global techmining conference, montreal, canada, 2012-09-05
作者:  Zhang X(张娴);  Zhang X(张娴);  Zhang X(张娴);  Zhang X(张娴)
收藏  |  浏览/下载：25/0  |  提交时间：2012/10/30
Investigation Based on Nano-Electromechanical System Double Si3N4 Resonant Beam Pressure Sensor 会议论文
作者:  Yang, Chuan;  Guo, Can;  Yuan, Xiaowei
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/10
基于NEMS技术的介电泳芯片及其关键工艺问题的研究 会议论文
第八届中国微米/纳米技术学术年会, 2006
刘泳宏; 赵湛
收藏  |  浏览/下载：3/0  |  提交时间：2010/09/04
Design and test of a micro digital thruster 会议论文
Proceedings of the SPIE - The International Society for Optical Engineering, Nanoengineering: Fabrication, Properties, Optics, and Devices V, San Diego, CA, USA, INSPEC
Dahai Ren; Gaofei Zhang; Xiaolu Wang; Zheng You
收藏  |  浏览/下载：3/0
Contrastive study on the mechanical performance of MEMS microsprings fabricated by LIGA and UV-LIGA technology 会议论文
Proceedings of the SPIE - The International Society for Optical Engineering, MEMS/MOEMS Technologies and Applications III, Beijing, China, INSPEC
Hua Li; Gengchen Shi
收藏  |  浏览/下载：2/0

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