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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study on the forming mechamism of serrated chip in high speed turning for steel (EI收录) 会议论文 Progress of Machining Technology - Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004, Suzhou, China, December 8, 2004 - December 11, 2004 作者:  Ye, Bangyan[1];  Xu, Jin[1];  Wu, Weijie[1];  Zhao, Xuezhi[1];  Liu, Xiaochu[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/18 Cutting  Hardness  Metallography  Quality control  Scanning electron microscopy  Shear deformation  Steel  Strain rate   The pseudoplastic behavior of bagasse kraft pulping black liquor (CPCI-S收录) 会议论文 Research Progress in Pulping and Papermaking, 2006 作者:  Yang Rendang;  Chen Kefu;  Chen Qifeng;  Yang Fei;  Xu Jun 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/18 bagasse kraft black liquor  pseudoplastic behavior  shear-rate  shear-thinning  apparent viscosity  flow behavior   The effect of carboxymethyl cellulose (CMC) on rheological behavior of paper coatings (CPCI-S收录) 会议论文 EMERGING TECHNOLOGIES OF PULPING & PAPERMAKING 作者:  Yang, RD;  Chen, KF 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/19 carboxymethyl cellulose (CMC)  shear-rate  rhealogical behavior  viscoelasticity  apparent viscosity  paper coatings   The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Li, Xun-Ping[1];  Xia, Jian-Min[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Electronics packaging  Intermetallics  Packaging  Shear flow  Soldered joints  Soldering alloys  Strain rate  Stress corrosion cracking  Textures