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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：132/0  |  提交时间：2021/02/02
Investigations on elastic properties and electronic structures of alpha-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：13/0  |  提交时间：2022/03/01
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：18/0  |  提交时间：2019/11/15
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81
作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng
收藏  |  浏览/下载：0/0  |  提交时间：2020/06/16
Wetting of liquid aluminum alloys on pure titanium at 873-973 K 期刊论文
Journal of Materials Research and Technology, 2019, 卷号: 8, 期号: 6, 页码: 5813-5822
作者:  Jin, Peng;  Liu, Yibo;  Sun, Qingjie;  Lin, Qiaoli;  Li, Junzhao
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Theoretical and experimental investigations on mechanical properties of Co1-xNixSn2 intermetallic compounds 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 14
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin;  Li, Yulong
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15
The characteristic of interface microstructure for aluminum-steel butt joint by arc assisted laser welding-brazing 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 9
作者:  Yu, Xiaoquan;  Fan, Ding;  Huang, Jiankang;  Kang, Yutao
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：27/0  |  提交时间：2021/02/02

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