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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Reproductive pattern and population dynamics of commercial red swamp crayfish (Procambarus clarkii) from China: implications for sustainable aquaculture management 期刊论文 PEERJ, 2019, 卷号: 7, 期号: 1, 页码: 24 作者:  Jin, Shiyu;  Jacquin, Lisa;  Xiong, Mantang;  Li, Ruojing;  Lek, Sovan 收藏  |  浏览/下载：60/0  |  提交时间：2019/07/01 Procambarus clarkii  Spawning period  Population growth  Mortality and exploitation rates  Sustainable management   Reproductive pattern and population dynamics of commercial red swamp crayfish (Procambarus clarkii) from China: implications for sustainable aquaculture management 期刊论文 PEERJ, 2019, 卷号: 7, 页码: 24 作者:  Zhang, Tanglin;  Li, Wei;  Lek, Sovan;  Li, Ruojing;  Xiong, Mantang 收藏  |  浏览/下载：62/0  |  提交时间：2019/03/05 Procambarus clarkii  Spawning period  Population growth  Mortality and exploitation rates  Sustainable management   Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao 收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02 Binary alloys  Copper alloys  Film thickness  Intermetallics  Lead-free solders  Molluscs  Ostwald ripening  Soldering  Tin alloys, Cooling rates  Furnace cooling  Grain diameter  Growth behavior  Growth behaviour  Layer thickness  Non-uniformities  Reflow temperatures, Cooling   Contribution of conspecific soil microorganisms to tree seedling light responses: Insights from two tropical species with contrasting shade tolerance 期刊论文 ENVIRONMENTAL AND EXPERIMENTAL BOTANY, 2019, 卷号: 166, 期号: x, 页码: - 作者:  Xi, Nianxun;  Bloor, Juliette M. G.;  Wang, Yan;  Chu, Chengjin 收藏  |  浏览/下载：64/0  |  提交时间：2019/09/23 Bauhinia brachycarpa  Bauhinia variegata  Growth rates  Functional traits  Light intensity  Nitrogen  Phosphorus  Plant-Soil feedback  Seedling morphology   Contribution of conspecific soil microorganisms to tree seedling light responses: Insights from two tropical species with contrasting shade tolerance 期刊论文 ENVIRONMENTAL AND EXPERIMENTAL BOTANY, 2019, 卷号: 166, 期号: x, 页码: - 作者:  Xi, Nianxun;  Bloor, Juliette M. G.;  Wang, Yan;  Chu, Chengjin 收藏  |  浏览/下载：59/0  |  提交时间：2019/10/21 Bauhinia brachycarpa  Bauhinia variegata  Growth rates  Functional traits  Light intensity  Nitrogen  Phosphorus  Plant-Soil feedback  Seedling morphology