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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Investigation of effects of pattern structures arrangement on chemical mechanical polishing process 会议论文 Shanghai, China, March 11, 2018 - March 12, 2018 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15 Chemical mechanical polishing  Pressure distribution  Semiconductor device manufacture  Signal processing  Silicon wafers  Textile printing  Chemical-mechanical polishing process  Contact pressure distribution  Pattern arrangement  Pattern structure  Polishing processs  Splitting signals   Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field 期刊论文 COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 155, 页码: 476-482 作者:  Guo, Xiaoguang;  Wang, Xiaoli;  Jin, Zhuji;  Kang, Renke 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02 Copper  Chemical mechanical polishing (CMP)  ReaxFF reactive force field  Polishing pressure   Design of an ultraprecision computerized numerical control chemical mechanical polishing machine and its implementation 期刊论文 OPTICAL ENGINEERING, 2018, 卷号: 57 作者:  Zhang, Chupeng;  Zhao, Huiying;  Zhu, Xueliang;  Zhao, Shijie;  Jiang, Chunye 收藏  |  浏览/下载：9/0  |  提交时间：2019/11/26 chemical mechanical polishing  design principle  diamond tool dressing  gas hydrostatic linear guideway  gas hydrostatic rotary table  kinematic errors  tin plate  ultraprecision machine tool   Improvement and application of pad conditioning accuracy in chemical mechanical polishing 期刊论文 Optical Engineering, 2018, 卷号: 57 作者:  Ban, Xinxing;  Zhao, Huiying;  Zhu, Xueliang;  Zhao, Shijie;  Xie, Ruiqing 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26 Application process  Chemical mechanical polishing(CMP)  Density distributions  Diamond conditioners  Kinematic Analysis  Optical processing  Planarity  Process parameters   Effect of motion accuracy on material removal during the CMP process for large-aperture plane optics 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 94, 页码: 105-119 作者:  Zhang, C. P.;  Zhao, H. Y.;  Xie, R. Q.;  Zhao, Z. X.;  Gu, Y. W. 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26 Chemical mechanical polishing  Run-out error  Stitching measurement  Uneven removal  Polishing efficiency and accuracy  Gas hydrostatic rotary table  Large-aperture optics   Effect of indentation speed on deformation behaviors of surface modified silicon: A molecular dynamics study 期刊论文 Computational Materials Science, 2018, 卷号: 155, 页码: 1-10 作者:  Chen, Juan;  Shi, Junqin;  Zhang, Meng;  Peng, Weixiang;  Fang, Liang 收藏  |  浏览/下载：6/0  |  提交时间：2019/11/26 Amorphous SiO2  Amorphous structures  Chemical-mechanical polishing process  Crystalline-to-amorphous  Deformation behavior  Molecular dynamics simulations  Nanoindentation tests  Surface-modified   Preparation of -alumina/silica core-shell abrasives and their chemical mechanical polishing performances on sapphire substrates 期刊论文 MICRO & NANO LETTERS, 2018, 卷号: 13, 页码: 1315-1320 作者:  Wang, Xin[1];  Lei, Hong[2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22 scanning electron microscopy  abrasives  surface roughness  friction  X-ray photoelectron spectra  abrasion  secondary ion mass spectra  silicon compounds  alumina  transmission electron microscopy  chemical mechanical polishing  composite materials  materials preparation  time of flight mass spectra  surface morphology  sapphire  core-shell structure  time-of-flight secondary ion mass spectroscopy  scanning electron microscopy  transmission electron microscopy  sapphire substrates  che   Roughness Reduction of Large-Area High-Quality Thick Al Coatings for Large-Size Echelle Gratings by Chemical Mechanical Polishing 期刊论文 Nanoscience and Nanotechnology Letters, 2018, 卷号: 10, 期号: 1, 页码: 69-74 作者:  Song, C.;  Li, Z. Z.;  Zhang, X.;  Li, Q.;  Yang, H. G. 收藏  |  浏览/下载：4/0  |  提交时间：2019/09/17 Thick Al Coatings  Echelle Grating  Chemical Mechanical Polishing  design  telescope  mirrors  Science & Technology - Other Topics  Materials Science  Physics