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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2015     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Variation-Aware, Reliability-Emphasized Design and Optimization of RRAM Using SPICE Model 其他 2015-01-01 Li, H.; Jiang, Z.; Huang, P.; Wu, Y.; Chen, H.Y.; Gao, B.; Liu, X. Y.; Kang, J. F.; Wong, H.S. P. 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 emerging memory  resistive switching memory  SPICE model  design tool  variability  reliability  DEVICE  SYSTEMS   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |  浏览/下载：80/0  |  提交时间：2015/12/31 silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2   Research on the Failure Mechanism of High-Power GaAs PCSS 期刊论文 2015, 卷号: 30, 页码: 2427-2434 作者:  Shi, Wei;  Ma, Cheng;  Li, Mengxia 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20 Power semiconductor switches  semiconductor device breakdown  semiconductor device reliability  semiconductor device thermal factors  semiconductor switches   A Research for Influence of Temperature on T/R Module in Radar 会议论文 2015 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM), 2015-01-01 作者:  Zhong, Ling;  Fu, Guicui;  Lu, Jiale 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 T/R module  solid-state microwave power device  temperature  behavioral model  operational reliability