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In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/09
Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
The Micro-structure of Shangjuxu Acupoint (ST37) by X-ray Phase-contrast CT Imaging based on Synchrotron Radiation 会议论文
作者:  Liu, Chenglin;  Wang, Fei;  Wang, Xiaohua;  Zhang, Dongming;  Zhang, Xinyi
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/19
Characterization of dislocations and sub-grain boundaries in mixed rare earth orthovanadate of Yb:YxLu1-xVO4 会议论文
6th International Symposium on Laser, Scintillator and Non Linear Optical Materials (ISLNOM), OCT 20-23, 2013
作者:  Zhong, Degao;  Teng, Bing;  Cao, Lifeng;  Fei, You;  Zhang, Shiming
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/31


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