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Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载:17/0  |  提交时间:2013/02/05
Mechanical Properties of Si Nanowires as Revealed by in Situ Transmission Electron Microscopy and Molecular Dynamics Simulations 期刊论文
Nano Letters, 2012, 卷号: 12, 期号: 4, 页码: 1898-1904
D. M. Tang; C. L. Ren; M. S. Wang; X. L. Wei; N. Kawamoto; C. Liu; Y. Bando; M. Mitome; N. Fukata; D. Golberg
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