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Effects of aging on structural evolution of the rapidly solidified Sn -Ag -Zn eutectic solder 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: Vol.468 No.1-2, 页码: 154-157
作者:  Wei, Chen;  Liu, Yongchang;  Gao, Zhiming;  Xu, Ronglei;  Yang, Kai
收藏  |  浏览/下载:6/0  |  提交时间:2019/11/21
Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: Vol.470 No.1-2, 页码: 145-149
作者:  Wei, Chen;  Liu, Yongchang;  Gao, Zhiming;  Ma, Changsheng;  Wan, Jingbo
收藏  |  浏览/下载:7/0  |  提交时间:2019/11/21
Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: Vol.463 No.1-2, 页码: 230-237
作者:  Wan, Jingbo;  Liu, Yongchang;  Wei, Chen;  Gao, Zhiming
收藏  |  浏览/下载:5/0  |  提交时间:2019/11/21


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