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Orthogonal Projection With Optimized Reserved Subcarriers Mapping for Sidelobe Suppression in OFDM Systems 期刊论文
IEEE ACCESS, 2019, 卷号: 7
作者:  Dai, Guangfa;  Chen, Shaoping;  Wang, Gaofeng
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05
Simulation of cross-correlated non-Gaussian random fields for layered rock mass mechanical parameters 期刊论文
Computers and Geotechnics, 2019, 卷号: 112
作者:  Chen, Dongfang;  Xu, Dingping;  Ren, Gaofeng;  Jiang, Quan;  Liu, Guofeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
Orthogonal Projection with Optimized Reserved Subcarriers Mapping for Sidelobe Suppression in OFDM Systems (Open Access) 期刊论文
IEEE Access, 2019, 卷号: 7
作者:  Dai, Guangfa;  Chen, Shaoping;  Wang, Gaofeng
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05
Avoiding blister defects in low-stress hydrogenated amorphous silicon films for MEMS sensors 期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 276
作者:  Wang, Junli;  Wu, Lixiang;  Chen, Xi;  Zhuo, Wenjun;  Wang, Gaofeng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05
Printed multi-band compound meta-loop antenna with hybrid-coupled SRRs 期刊论文
IET MICROWAVES ANTENNAS & PROPAGATION, 2018, 卷号: 12, 期号: 8
作者:  Xu, Kuiwen;  Liu, Yang;  Dong, Linxi;  Peng, Liang;  Chen, Shichang
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/05
Wideband Modeling and Characterization of Differential Through-Silicon Vias for 3-D ICs 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 卷号: 63, 期号: 3
作者:  Zhao, Wen-Sheng;  Zheng, Jie;  Liang, Feng;  Xu, Kuiwen;  Chen, Xi
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05
Novel compound planar spiral antenna 期刊论文
Lecture Notes in Electrical Engineering, 2014, 卷号: 238 LNEE
作者:  Chen, Mingqing;  Wang, Gaofeng;  Zhou, Shuhua
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
Three-Dimensional On-Chip Inductor Design Based on Through-Silicon Vias 会议论文
作者:  Chen, Aobo;  Liang, Feng;  Zhao, Si-Qi;  Wang, Gaofeng
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05
Accuracy-Controlled Convergence Criterion for Full Wave Simulation 会议论文
作者:  Ding, Wen;  Wang, Gaofeng;  Chen, Xi
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05
Three-dimensional on-chip inductor design based on through-silicon vias 期刊论文
Proceedings of International Conference on ASIC, 2013
作者:  Wang, Gaofeng;  Chen, Aobo;  Zhao, Si-Qi;  Liang, Feng
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05

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