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科研机构
上海大学 [25]
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会议论文 [20]
期刊论文 [5]
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2019 [1]
2018 [2]
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专题:上海大学
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Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 744, 页码: 406-414
作者:
Long, Xu[1]
;
Li, Zhen[2]
;
Lu, Xiuzhen[3]
;
Guo, Hongcun[4]
;
Chang, Chao[5]
收藏
  |  
浏览/下载:49/0
  |  
提交时间:2019/04/22
Sintered silver nanoparticle
SiC microparticle
Nanoindentation
Mechanical property
Constitutive behaviour
Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation
期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2018, 卷号: 10
作者:
Long, Xu[1]
;
Du, Chongyang[2]
;
Li, Zhen[3]
;
Guo, Hongcun[4]
;
Yao, Yao[5]
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2019/04/22
Sintered silver nanoparticle
SiC microparticle
constitutive model
nanoindentation
finite element analysis
The influence of sintering process on thermal properties of nano-silver paste
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Lu, Xiuzhen[1]
;
Zhang, Qianran[2]
;
Zehri, Abdelhafid[3]
;
Ke, Wei[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2019/04/22
Thermal conductivity
Sintering temperature
sintering time
nano-silver paste
SiC particles
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Effect of sintering method on properties of nanosilver paste
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Zhang, Qiaoran[1]
;
Liu, Jiawen[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Latorre, Marti Gutierrez[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
nanosilver
sintering
thermal conductivity
shear strength
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yang, Yiqun[1]
;
Ye, Hui[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Wang, Nan[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/24
heat dissipation
silver coated graphene
electrically conductive adhesive
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER
会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:
Ye, Hui[1]
;
Huang, Shirong[2]
;
Yuan, Zhichao[3]
;
Lu, Xiuzhen[4]
;
Jeppson, Kjell[5]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:
Zhang, Yong[1]
;
Huang, Shirong[2]
;
Wang, Nan[3]
;
Bao, Jie[4]
;
Sun, Shuangxi[5]
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/04/26
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
期刊论文
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49
作者:
Bao, Jie[1]
;
Edwards, Michael[2]
;
Huang, Shirong[3]
;
Zhang, Yong[4]
;
Fu, Yifeng[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/26
boron nitride
thermal conduction
lateral heat spreader
electrical insulation
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