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Fire-needle acupuncture for upper limb spastic paralysis after stroke: Study protocol for a randomized controlled trial 期刊论文
Journal of integrative medicine, 2019
作者:  Yue Xin-Yu[1];  Feng Zhuo-Qi[2];  Yu Xi-Yi[3];  Hu Jia-Min[4];  He Xiao-Jing[5]
收藏  |  浏览/下载:15/0  |  提交时间:2019/04/22
Mesostructured Nanomagnetic Polyhedral Oligomeric Silsesquioxanes (POSS) Incorporated with Dithiol Organic Anchors for Multiple Pollutants Capturing in Wastewater 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2013, 卷号: 5, 页码: 8058-8066
作者:  He, Hai-Bo[1];  Li, Bin[2];  Dong, Jun-Ping[3];  Lei, Yun-Yi[4];  Wang, Tian-Lin[5]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/30
Cu-Al-Ni-Be形状记忆合金单晶制备及其性能特性研究 期刊论文
功能材料, 2007, 卷号: 38, 页码: 1474-1477
作者:  Zhu, Ming[1];  Wang, Le-You[2];  Song, Gao-Feng[3];  Mao, Xie-Min[4];  Zhai, Qi-Jie[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/05/10
DSP-based intelligent tension controller 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者:  Zhou, Qi-Hong[1];  He, Yong-Yi[2];  Guo, Shuai[3];  Fang, Ming-Lun[4]
收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10
DSP-based Intelligent Tension Controller 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhou Qi-hong[1];  He Yong-yi[2];  Guo Shuai[3];  Fang Ming-lun[4]
收藏  |  浏览/下载:1/0  |  提交时间:2019/05/10
DSP-based Intelligent Tension Controller 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhou Qi-hong[1];  He Yong-yi[2];  Guo Shuai[3];  Fang Ming-lun[4]
收藏  |  浏览/下载:3/0  |  提交时间:2019/05/10
DSP-based Intelligent Tension Controller 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhou Qi-hong[1];  He Yong-yi[2];  Guo Shuai[3];  Fang Ming-lun[4]
收藏  |  浏览/下载:7/0  |  提交时间:2019/05/10
DSP-based Intelligent Tension Controller 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhou Qi-hong[1];  He Yong-yi[2];  Guo Shuai[3];  Fang Ming-lun[4]
收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10


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