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Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step 期刊论文
Applied physics a-materials science & processing, 2008, 卷号: 91, 期号: 2, 页码: 301-303
作者:  Ji, Zhuoyu;  Li, Hongxiang;  Liu, Yaling;  Hu, Wenping
收藏  |  浏览/下载:15/0  |  提交时间:2019/05/10
High-performance air-stable bipolar field-effect transistors of organic single-crystalline ribbons with an air-gap dielectric 期刊论文
Advanced materials, 2008, 卷号: 20, 期号: 8, 页码: 1511-+
作者:  Tang, Qingxin;  Tong, Yanhong;  Li, Hongxiang;  Ji, Zhuoyu;  Li, Liqiang
收藏  |  浏览/下载:21/0  |  提交时间:2019/05/10
The replacement reaction controlling the fractal assembly of copper nanoparticles 期刊论文
Nanotechnology, 2008, 卷号: 19, 期号: 13, 页码: 5
作者:  Ji, Zhuoyu;  Li, Hongxiang;  Liu, Yaling;  Hu, Wenping;  Liu, Yunqi
收藏  |  浏览/下载:12/0  |  提交时间:2019/05/10
In situ synthesizing molecular materials between coplanar gold microgap electrodes for the fabrication of molecular devices 期刊论文
Applied physics letters, 2008, 卷号: 92, 期号: 2, 页码: 3
作者:  Liu, Yaling;  Ji, Zhuoyu;  Li, Hongxiang;  Hu, Wenping;  Zhu, Daoben
收藏  |  浏览/下载:9/0  |  提交时间:2019/05/10
Surface nanostructures orienting self-protection of an orthodontic nickel-titanium shape memory alloys wire 期刊论文
Chinese science bulletin, 2007, 卷号: 52, 期号: 21, 页码: 3020-3023
作者:  Nie Qiong;  Ji ZhuoYu;  Lin JiuXiang;  Hu WenPing
收藏  |  浏览/下载:59/0  |  提交时间:2019/05/10
A new morphology of copper 7,7,8,8-tetracyano-p-quinodimethane 期刊论文
Micron, 2007, 卷号: 38, 期号: 5, 页码: 536-542
作者:  Liu, Yaling;  Li, Hongxiang;  Ji, Zhuoyu;  Kashimura, Yoshiaki;  Tang, Qingxin
收藏  |  浏览/下载:19/0  |  提交时间:2019/05/10


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