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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Acid-treated Ti4+ doped hematite photoanode for efficient solar water oxidation-Insight into surface states and charge separation 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 782, 页码: 943-951 作者:  Wu, Qiannan;  Meng, Dedong;  Zhang, Yu;  Zhao, Qidong;  Bu, QiJing 收藏  |  浏览/下载：28/0  |  提交时间：2019/12/02 Surface states  Hematite  Water oxidation  Acid-treatment  Charge separation   Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26 作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 Cu/Sn/Cu interconnect  fine-pitch interconnect  solid-state-diffusion (SSD) bonding  wafer-level bonding   Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration 期刊论文 APPLIED SURFACE SCIENCE, 2017, 卷号: 403, 页码: 525-530 作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Tan, Lin;  Cai, Jian 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 3D integration  low temperature Cu-Sn bonding  Plasma pretreatment  Self-assembled monolayer (SAM)   Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding 会议论文 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01 作者:  Cai, Jian;  Wang, Qian;  Wang, Dejun;  Wang, Junqiang;  Wu, Zijian 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 3D integration  solid-state-diffusion (SSD)  bonding  surface pretreatment  electromigration (EM)   Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 6111-6118 作者:  Wu, Zijian;  Cai, Jian;  Wang, Qian;  Wang, Junqiang;  Wang, Dejun 收藏  |  浏览/下载：12/0  |  提交时间：2019/12/09 Wafer-level package  hermetic sealing  Cu/Sn TLP bonding  intermetallic compound  aging test   Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection 期刊论文 APPLIED SURFACE SCIENCE, 2016, 卷号: 384, 页码: 200-206 作者:  Wang, Junqiang;  Wang, Qian;  Liu, Ziyu;  Wu, Zijian;  Cai, Jian 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09 3D interconnection  Low temperature Cu-Sn bonding  Surface activation  Plasma pretreatment   Improved magnetic sensitivity of CMOS vertical Hall device by using partial implantation technique 会议论文 2014-01-01 作者:  Huang, Haiyun;  Xu, Yue;  Wang, Dejun;  Wu, Jun;  Qin, Huibin 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 A compact behavioral simulation model for CMOS vertical hall-effect devices 会议论文 2014-01-01 作者:  Huang, Haiyun;  Xu, Yue;  Wang, Dejun;  Wu, Jun;  Qin, Huibin 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11