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CORC

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Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 83, 页码: 198-205
作者:  Ma, Haoran;  Kunwar, Anil;  Chen, Jun;  Qu, Lin;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Kunwar, Anil;  Ma, Haoran;  Qi, Meng;  Sun, Junhao;  Qu, Lin
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 467-474
作者:  Qu, Lin;  Zhao, Ning;  Ma, Haitao;  Zhao, Huijing;  Huang, Mingliang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction 期刊论文
JOURNAL OF APPLIED PHYSICS, 2014, 卷号: 115
作者:  Qu, Lin;  Zhao, Ning;  Ma, Haitao;  Zhao, Huijing;  Huang, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Mechanism of Cu6Sn5 layer act as a diffusion barrier layer 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Li, Hua;  Qu, Lin;  Zhao, Huijing;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Qu, Lin;  Ma, Haitao;  Zhao, Huijing;  Zhao, Ning;  Kunwar, Anil
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/11
The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Zhao, Huijing;  Qu, Lin;  Li, Hua;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11

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