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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Method of Smartphone Navigation Heading Compensation Based on Gravimeter 其他 2018-01-01 作者:  Zeng, Shijie;  Zeng, Qinghua;  Meng, Qian;  Liu, Jianye;  Chen, Ruizhi 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05 Gravity assisted  Smartphone navigation  Heading compensation   Method of Smartphone Navigation Heading Compensation Based on Gravimeter 其他 2018-01-01 作者:  Zeng, Shijie;  Zeng, Qinghua;  Meng, Qian;  Liu, Jianye;  Chen, Ruizhi 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05 Gravity assisted  Smartphone navigation  Heading compensation   Constructions of 11/2-designs from orthogonal geometry over finite fields 其他 2016-01-01 Feng, Rongquan; Zhao, Meng; Zeng, Liwei 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 11/2-design  Orthogonal space  Totally isotropic subspace  Directed strongly regular graph  STRONGLY REGULAR GRAPHS   Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他 2016-01-01 Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 TSV  MEMS  Thermo-mechanical Reliability  Seal Ring  Optimization  INTEGRATION   Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices 其他 2016-01-01 Meng, Wei; Jin, Yufeng; Guan, Yong; Zeng, Qinghua; Hen, Jing C. 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System   Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 through silicon via  packaging  electroplating  additives   Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 through silicon via  3D packaging  DRJE   Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging 其他 2016-01-01 Meng, Wei; Zeng, Qinghua; Guan, Yong; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 MEMS packaging  reliability  RDL opening  copper thickness  insulation layer thickness  3D INTEGRATION  METALLIZATION  OPTIMIZATION  SILICON  COPPER   Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他 2016-01-01 Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips 其他 2016-01-01 Meng, Wei; Guan, Yong; Zeng, Qinghua; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03