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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 On computer virus spreading using node-based model with time-delayed intervention strategies 其他 2019-01-01 作者:  Yu, Yi;  Hu, Jiangping;  Zeng, Yong 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05 Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他 2016-01-01 Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 TSV  MEMS  Thermo-mechanical Reliability  Seal Ring  Optimization  INTEGRATION   Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他 2016-01-01 Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 TSV  3D packaging  sidewall insulation  electrical properties  CMP  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices 其他 2016-01-01 Meng, Wei; Jin, Yufeng; Guan, Yong; Zeng, Qinghua; Hen, Jing C. 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System   Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 through silicon via  packaging  electroplating  additives   Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 through silicon via  3D packaging  DRJE   Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging 其他 2016-01-01 Meng, Wei; Zeng, Qinghua; Guan, Yong; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 MEMS packaging  reliability  RDL opening  copper thickness  insulation layer thickness  3D INTEGRATION  METALLIZATION  OPTIMIZATION  SILICON  COPPER   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他 2016-01-01 Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 THROUGH-SILICON VIAS