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CORC

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A Novel Surveillance System Applied in Civil Airport 其他
2016-01-01
Sun, Hua Bo; Zhong, Min Zhu; Miao, Ling Yun; Wang, Xin; Zhao, Hai Meng
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
High Frequency Analysis and Characterization of TSVs for High-Speed Integrated Systems 其他
2016-01-01
Miao, Min; Fang, Runiu; Sun, Xin; Cui, Xiaole; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Stabilization and Utilization of Coupling MOS Capacitance between TSVs 其他
2016-01-01
Fang, Runiu; Liu, Huan; Miao, Min; Sun, Xin; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Bias-dependent High Frequency Characterization of Through-Silicon Via (TSV) for 3D Integration 其他
2016-01-01
Sun, Xin; Fang, Runiu; Liu, Huan; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
K-Means Clustering Algorithm for Full Duplex Communication 其他
2016-01-01
Sun, Jie; Liu, Zhi-Min
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
A density functional theory study of the tunable structure, magnetism and metal-insulator phase transition in VS2 monolayers induced by in-plane biaxial strain 其他
2015-01-01
Kan, Min; Wang, Bo; Lee, Young Hee; Sun, Qiang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Noise coupling between through-silicon vias and active devices for 20/14-nm technology nodes 其他
2015-01-01
Fang, Runiu; Sun, Xin; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/04
Bibliometric and social network analysis of the SoS Field 其他
2014-01-01
You, Guang-rong; Sun, Xiao; Sun, Min; Wang, Ji-min; Chen, Ying-wu
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17

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