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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on Combustion Heat Release Rate Testing Technology Based on TDLAS (CPCI-S收录) 会议 作者:  Liu, Jian-yong[1,2,3];  Zhao, Xia[1,2];  Gao, Shi-jie[1,2];  Ma, Xiao-qian[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TDLAS  Paramagnetic  Heat Release Rate  Combustion   Temporal and spatial variations of contaminant removal, enzyme activities, and microbial community structure in a pilot horizontal subsurface (CPCI-S收录) 会议 作者:  Yi, Xiao-Hui[1,2];  Jing, Dan-Dan[1,2];  Wan, Jinquan[1,2,3];  Ma, Yongwen[1,2,3];  Wang, Yan[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Constructed wetland  Enzyme activity  Spatiotemporal variation  Microbial structure  PAHs  Industrial runoff   Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Dynamic transition in the discharge current between gas-dominant discharge and self-sputtering in high-power impulse magnetron sputtering (CPCI-S收录) 会议 作者:  Wu, Zhongzhen[1];  Xiao, Shu[1];  Ma, Zhengyong[1];  Cui, Suihan[1];  Pan, Feng[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Discharge current  High-power impulse magnetron sputtering  Dynamic transition  Temperature   Teachers' influence on glasses purchase and wear in China: the PRICE (Potentiating Rural Investment in Children's Eyecare) study (CPCI-S收录) 会议 作者:  Wang, Xiuqin[1,2];  Ma, Yue[3];  Zhou, Yuan[4];  Jin, Ling[1];  Xiao, Baixiang[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Research on Combustion Heat Release Rate Testing Technology Based on TDLAS (EI收录) 会议 Guangzhou, China, 作者:  Liu, Jian-Yong[1,2,3];  Zhao, Xia[1,2];  Gao, Shi-Jie[1,2];  Ma, Xiao-Qian[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Combustion  Fire extinguishers  Fires  Oxygen  Paramagnetism  Testing   Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zhu, Yunhui[1];  Zeng, Qinghua[1];  Ma, Shenglin[1,2];  Su, Fei[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11