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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 SPN modeling for GDCS task scheduling (EI收录) 会议论文 Proceedings of the 26th Chinese Control Conference, CCC 2007, Zhangjiajie, China, July 26, 2007 - July 31, 2007 作者:  Jian, Yang[1,2];  Daoping, Huang[1];  Xiaoya, Li[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Distributed parameter control systems  Grid computing  Petri nets  Random processes   Energy efficient routing protocol based on residual energy and energy consumption rate for heterogeneous wireless sensor networks (EI收录) 会议论文 Proceedings of the 26th Chinese Control Conference, CCC 2007, Zhangjiajie, China, July 26, 2007 - July 31, 2007 作者:  Xiaoya, Li[1];  Daoping, Huang[1];  Jian, Yang[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/17 Base stations  Computer simulation  Energy utilization  Routing protocols   A Novel Nickel Nanocone Array Current Collector for High Performance supercapacitor (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xie, Binghe[1];  Yang, Cheng[1];  Su, Zijin[1];  Zhang, Zhexu[1];  Cui, Xiaoya[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/12 supercapacitor  nickel nanocone array  electrochemical perpformance   A highly conductive thermoplastic electrically conductive adhesive for flexible and low cost electronics (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wu, Haoyi[1];  Yang, Cheng[1];  Liu, Jingping[1];  Cui, Xiaoya[1];  Xie, Binghe[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 printed electronics  flexible electronics  conductive adhesive   Scalable Synthesis of the Mono-dispersed Silver Micro-dendrites and Their Applications in the Ultralow Cost Printed Electrically Conductive A (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Cui, Xiaoya[1];  Yang, Cheng[1];  Zhang, Zhexu[1];  Wu, Haoyi[1];  Chiang, Sumwai[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 silver dendrites  3-D fractal structure  electrically conductive adhesives  percolation threshold  low-temperature sintering