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A bump transfer method for flip chip assembly 会议论文
5th Electronics Packaging Technology Conference, EPTC 2003, 2003-12-10
作者:  Zhang, J.[1];  Wang, C.H.[2]
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Study on the synthetic process of calcium borate (EI收录) 会议论文
Key Engineering Materials
作者:  Cao, C.E.[1,2];  Wang, Y.J.[1];  Zheng, N.Z.[2];  Xiong, C.H.[2];  Shen, H.R.[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/18
Optical properties enhancement in low-bandgap organic solar cells with embedded PEDOT:PSS gratings (EI收录) 会议论文
Proceedings of SPIE - The International Society for Optical Engineering, San Diego, CA, United states, August 14, 2012 - August 16, 2012
作者:  Zhu, Xiaolong[1];  Duan, Chuihui[2];  Choy, Wallace C.H.[1];  Xie, Fengxian[1];  Wang, Chuandao[1]
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Tilting motion control of narrow tilting vehicles (EI收录) 会议论文
24th International Battery, Hybrid and Fuel Cell Electric Vehicle Symposium and Exhibition 2009, EVS 24, Stavanger, Norway, May 13, 2009 - May 16, 2009
作者:  Lin, Chun-Ying[1];  Chien, C.-P.[2];  Chiou, Jin-Chern[1];  Chen, Chih-Liang[1];  Wang, James H.[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/17


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