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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5]
收藏  |  浏览/下载:13/0  |  提交时间:2019/04/22
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载:17/0  |  提交时间:2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载:41/0  |  提交时间:2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/24
Gemini Surfactant Influence on Interfacial Tension of Daqing Crude Oil 会议论文
作者:  Bao, Shujing;  Zhang, Shousong;  Fan, Zhenzhong;  Wang, Meng;  Liu, Ling
收藏  |  浏览/下载:2/0  |  提交时间:2018/11/12
Study on validation method for femur finite element model under multiple loading conditions 会议论文
IOP Conference Series: Materials Science and Engineering, 022061, 2018
作者:  Fengjiao Guan;  Guanjun Zhang;  Jie Liu;  Shujing Wang and Xu Luo
收藏  |  浏览/下载:0/0  |  提交时间:2019/12/25


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