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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Infinite Author Topic Model based on Mixed Gamma-Negative Binomial Process 会议论文 IEEE International Conference on Data Mining (ICDM), 2015-01-01 作者:  Xuan, Junyu[1];  Lu, Jie[2];  Zhang, Guangquan[3];  Xu, Richard Yi Da[4];  Luo, Xiangfeng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 Text mining  Topic models  Bayesian nonparametric learning   Investigation of the effect of processing variables on the structure and morphology of Nano-TIM 会议论文 HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26 作者:  Wang, Wen Xuan[1];  Lu, Xiuzhen[2];  Liu, Johan[3];  Wang, Xu[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Development of high adhesion nano-thermal interface materials for electronics packaging applications 会议论文 International Conference on Electronic Materials and Packaging, 2006-12-11 作者:  Aronsson, Tomas[1];  Wang, Wen Xuan[2];  Olorunyomi, Michael Olugbenga[3];  Lu, Xiuzhen[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 New nano-thermal interface material for heat removal in electronics packaging 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Liu, Johan[1];  Olorunyomi, Michael Olugbenga[2];  Lu, Xiuzhen[3];  Wang, Wen Xuan[4];  Aronsson, Tomas[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices 会议论文 IMAPS Nordic Annual Conference 2006, 2006-09-17 作者:  Liu, Johan[1];  Wang, Teng[2];  Guan, Wanbing[3];  Olorunyomi, Michael Olugbenga[4];  J?nsson, Martin[5] 收藏  |  浏览/下载：0/0  |  提交时间：2019/05/10 New nano-thermal interface material for heat removal in electronics packaging 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Liu, Johan[1];  Olorunyomi, Michael Olugbenga[2];  Lu, Xiuzhen[3];  Wang, Wen Xuan[4];  Aronsson, Tomas[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 New nano-thermal interface materials (Nano-TIMs) with SiC nano-particles used for heat removal in electronics packaging applications 会议论文 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006-12-11 作者:  Wen, Xuan Wang[1];  Lu, Xiuzhen[2];  Liu, Johan[3];  Olorunyomi, Michael Olugbenga[4];  Aronsson, Tomas[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10