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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Wang, Nan[1]
;
Chen, Shujing[2]
;
Nkansah, Amos[3]
;
Darmawan, Christian Chandra[4]
;
Ye, Lilei[5]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/22
Graphene film
Lamination
Light-weight
Thermal resistance
Synthesis of a graphene carbon nanotube hybrid film by joule self-heating CVD for thermal applications
会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, 2018-05-29
作者:
Hansson, Josef[1]
;
Samani, Majid Kabiri[2]
;
Nylander, Andreas[3]
;
Ye, Lilei[4]
;
Wang, Nan[5]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/22
Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications
会议论文
2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018, 2018-06-12
作者:
Nkansah, Amos[1]
;
Wang, Nan[2]
;
Ye, Lilei[3]
;
Wang, Xitao[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/22
Sintering of SiC enhanced copper paste for high power applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Gutierrez, Marti[1]
;
Wang, Nan[2]
;
Samani, Majid Kabiri[3]
;
Ye, Lilei[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/24
Copper
nanoparticle
sintering
TIM
thermal characterization
heat management
Effect of sintering method on properties of nanosilver paste
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Zhang, Qiaoran[1]
;
Liu, Jiawen[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Latorre, Marti Gutierrez[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
nanosilver
sintering
thermal conductivity
shear strength
Fabrication and Characterization of Graphene Based Film
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Shi, Yuqing[1]
;
Ye, Lilei[2]
;
Zehri, Abdel Hafid[3]
;
Logothetis, Nikolas[4]
;
Su, Peng[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/24
graphme film
electrospray deposition
film fabrication
flexible film
Graphene-based Heat Spreading Materials for Electronics Packaging Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yuan, Guangjie[1]
;
Shan, Bo[2]
;
Chen, Shujing[3]
;
Yang, Yiqun[4]
;
Bao, Jie[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/24
heat spreading materials
graphene-based film
graphene-based electrically conductive adhesive
electronics packaging
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yang, Yiqun[1]
;
Ye, Hui[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Wang, Nan[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/24
heat dissipation
silver coated graphene
electrically conductive adhesive
Operational Reliability Assessment Using Multivariate Covariates
会议论文
2017 ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2017-01-01
作者:
Liu, Chenxi[1]
;
Chen, Nan[2]
;
Ji, Peng[3]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/24
competing failure mode
environmental covariates
response covariates
time-to-failure
Operational Reliability Assessment Using Multivariate Covariates
会议论文
Annual Reliability and Maintainability Symposium (RAMS)
作者:
Liu, Chenxi[1]
;
Chen, Nan[2]
;
Ji, Peng[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/24
competing failure mode
environmental covariates
response covariates
time-to-failure
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