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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5]
收藏  |  浏览/下载:13/0  |  提交时间:2019/04/22
Synthesis of a graphene carbon nanotube hybrid film by joule self-heating CVD for thermal applications 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, 2018-05-29
作者:  Hansson, Josef[1];  Samani, Majid Kabiri[2];  Nylander, Andreas[3];  Ye, Lilei[4];  Wang, Nan[5]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/22
Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications 会议论文
2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018, 2018-06-12
作者:  Nkansah, Amos[1];  Wang, Nan[2];  Ye, Lilei[3];  Wang, Xitao[4];  Liu, Johan[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/22
Sintering of SiC enhanced copper paste for high power applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Gutierrez, Marti[1];  Wang, Nan[2];  Samani, Majid Kabiri[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载:16/0  |  提交时间:2019/04/24
Fabrication and Characterization of Graphene Based Film 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Shi, Yuqing[1];  Ye, Lilei[2];  Zehri, Abdel Hafid[3];  Logothetis, Nikolas[4];  Su, Peng[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/24
Operational Reliability Assessment Using Multivariate Covariates 会议论文
2017 ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2017-01-01
作者:  Liu, Chenxi[1];  Chen, Nan[2];  Ji, Peng[3]
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/24
Operational Reliability Assessment Using Multivariate Covariates 会议论文
Annual Reliability and Maintainability Symposium (RAMS)
作者:  Liu, Chenxi[1];  Chen, Nan[2];  Ji, Peng[3]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/24


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