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CORC

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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5]
收藏  |  浏览/下载：13/0  |  提交时间：2019/04/22
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
Synthesis of a graphene carbon nanotube hybrid film by joule self-heating CVD for thermal applications 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, 2018-05-29
作者:  Hansson, Josef[1];  Samani, Majid Kabiri[2];  Nylander, Andreas[3];  Ye, Lilei[4];  Wang, Nan[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/22
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24
Fabrication and Characterization of Graphene Based Film 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Shi, Yuqing[1];  Ye, Lilei[2];  Zehri, Abdel Hafid[3];  Logothetis, Nikolas[4];  Su, Peng[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
Fabrication of Carbon Nanowalls and its Application in Heat Dissipation 会议论文
Microtechnology and Thermal Problems in Electronics
作者:  Yan Zhang[1];  Shiwei Ma[2];  Jingyu Fan[3];  Aneta Arazna[4];  Kamil Janeczek[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24

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