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西安光学精密机械研究... [6]
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会议论文 [11]
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optics [2]
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High power multiple wavelength diode laser stack for DPSSL application without temperature control
会议论文
San Francisco, CA, United states, 2018-01-30
作者:
Hou, Dong
;
Yin, Xia
;
Wang, Jingwei
;
Chen, Shi
;
Zhan, Yun
收藏
  |  
浏览/下载:63/0
  |  
提交时间:2018/04/25
A New Approach of Oil Spill Detection with Time-resolved LIF Polarization Spectrum Combined with Principle Component Analysis
会议论文
作者:
Luan, Xiaoning
;
Zhang, Feng
;
Guo, Jinjia
;
Cui, Tingwei
;
Zheng, Ronger
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2018/12/07
oil spill classification
time-resolved fluorescence
LIF
polarization
PCA
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum
会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:
Hou, Dong
;
Wang, Jingwei
;
Gao, Lijun
;
Liang, Xuejie
;
Li, Xiaoning
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2016/10/18
Horizontal array
Hard Solder
Spetrum Control
Packaging of Hard Solder 500W QCW Diode Laser Array
会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:
Li, Xiaoning
;
Wang, Jingwei
;
Hou, Dong
;
Nie, Zhiqiang
;
Liu, Xingsheng
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2016/10/18
diode laser
MCC
hard solder
high power
Advances in Bonding Technology for High Power Diode Laser Bars
会议论文
作者:
Wang, Jingwei
;
Li, Xiaoning
;
Hou, Dong
;
Feng, Feifei
;
Liu, Yalong
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
indium-free packaging
bonding
reliability
lifetime
hard pulse
Laser bar
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array
会议论文
作者:
Wang, Jingwei
;
Li, Xiaoning
;
Feng, Feifei
;
Liu, Yalong
;
Hou, Dong
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/02
conduction cooled
hard solder
indium-free
packaging process
reliability
AuSn
hard pulse
Diode laser
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays
会议论文
作者:
Zhang, Pu
;
Wang, Jingwei
;
Xiong, Lingling
;
Li, Xiaoning
;
Hou, Dong
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Packaging
Interface layer
Voids
Spectrum
Diode laser array
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array
会议论文
20th international symposium on high power laser systems and applications (hpls and a), chengdu, peoples r china, 2014-08-25
作者:
Wang, Jingwei
;
Li, Xiaoning
;
Feng, Feifei
;
Liu, Yalong
;
Hou, Dong
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2015/12/04
Advances in Bonding Technology for High Power Diode Laser Bars
会议论文
conference on components and packaging for laser systems, san francisco, ca, 2015-02-09
作者:
Wang, Jingwei
;
Li, Xiaoning
;
Hou, Dong
;
Feng, Feifei
;
Liu, Yalong
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2015/12/04
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays
会议论文
conference on components and packaging for laser systems, san francisco, ca, 2015-02-09
作者:
Zhang, Pu
;
Wang, Jingwei
;
Xiong, Lingling
;
Li, Xiaoning
;
Hou, Dong
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2015/12/04
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