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RMTrack: 6D Object Pose Tracking by Continuous Image Render Match 会议论文
网络, 2022年1月7-9日
作者:  Cao Enyuan;  Zhu Xiaoyang;  Yu Haitao;  Jiang Yongshi
收藏  |  浏览/下载：9/0  |  提交时间：2022/12/07
Enhancing Rock Painting Tour Experience with Outdoor Augmented Reality 会议论文
Beijing, 2019-10-14
作者:  Zhang, Qi;  Zhu, Xiaoyang;  Yu, Haitao;  Jiang, Yongshi
收藏  |  浏览/下载：16/0  |  提交时间：2020/06/10
Research on Obstacle Avoidance Path Planning Algorithm for Six-axis Robot 会议论文
Wuyi Mountain, Fujian, China, 2018
作者:  Shanshan Jiang;  Haitao Fang;  Kai He;  Chaoyu Yan
收藏  |  浏览/下载：31/0  |  提交时间：2019/01/31
Genomic alterations, mutation burden, and microsatellite instability status of Chinese intrahepatic cholangiocarcinoma 会议论文
CANCER RESEARCH, 2018-07-01
作者:  Cao, Jingyu;  Jiang, Bo;  Liu, Zimin;  Shu, Weibin;  Li, Lei
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03
THTM: A Template Matching Algorithm Based on HOG Descriptor and Two-Stage Matching 会议论文
ADVANCES IN MATERIALS, MACHINERY, ELECTRONICS II, 2018-01-01
作者:  Jiang, Yuanjie;  Ruan, Li;  Xiao, Limin;  Liu, Xi;  Yuan, Feng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30
The Longest Common Exemplar Subsequence Problem 会议论文
IEEE International Conference on Bioinformatics and Biomedicine (BIBM), DEC 03-06, 2018
作者:  Zhang, Shu;  Wang, Ruizhi;  Zhu, Daming;  Jiang, Haitao;  Feng, Haodi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
The Longest Common Exemplar Subsequence Problem 会议论文
2018 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2018, December 3, 2018 - December 6, 2018
作者:  Zhang, Shu;  Wang, Ruizhi;  Zhu, Daming;  Jiang, Haitao;  Feng, Haodi
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
A Novel Hybrid Subset-Learning Method for Predicting Risk Factors of Atherosclerosis 会议论文
作者:  Xie, Jiang;  Wang, Haitao;  Zhang, Jiyuan;  Meng, Chao;  Kong, Yanyan
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
A novel hybrid subset-learning method for predicting risk factors of atherosclerosis 会议论文
作者:  Jiang Xie (1);  Haitao Wang (1);  Jiyuan Zhang (1);  Chao Meng (2);  Yanyan Kong (3)
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

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