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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 内容类型：会议论文    专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging 会议论文 6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13 作者:  Huang, Shirong[1];  Wang, Ning[2];  Bao, Jie[3];  Ye, Hui[4];  Zhang, Dongsheng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26 vertically aligned multiwall carbon nanotubes  electronic packaging  infrared emissivity characterization  homogeneous sparseness   The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging