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Research on high precision permanent magnet servo control system for laser communication 会议论文
Chengdu, China, 2018-05-23
作者:  Cao, Yu;  Wang, Haitao;  Jing, Feng;  Han, Junfeng;  Xie, Meilin
收藏  |  浏览/下载：37/0  |  提交时间：2018/09/13
Compton scatter tomography with photon-counting detector: a preliminary study 会议论文
作者:  Wang, Kai;  Cheng, Haitao;  Chen, Xi;  Mou, Xuanqin
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/19
Study on guide hole detection method for precise assembly based on binocular stereo vision 会议论文
作者:  Lin, Jiansong;  Wang, Haitao;  Hu, Shi;  Ma, Chi
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/19
Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Ji, Shengnan;  Ma, Haitao;  Wang, Chen;  Zhao, Ning;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ji, Shengnan;  Wang, Chen;  Wang, Yunpeng;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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