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The Mechanisms on Combinging Constraint Motion in Finite Space with Maching Process for 6-DOF Robot 会议论文
Macau SAR, China
作者:  Hui Xu;  Qing Wang;  Haitao Fang;  Kai He
收藏  |  浏览/下载：16/0  |  提交时间：2018/02/02
A Novel Hybrid Subset-Learning Method for Predicting Risk Factors of Atherosclerosis 会议论文
作者:  Xie, Jiang;  Wang, Haitao;  Zhang, Jiyuan;  Meng, Chao;  Kong, Yanyan
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
A novel hybrid subset-learning method for predicting risk factors of atherosclerosis 会议论文
作者:  Jiang Xie (1);  Haitao Wang (1);  Jiyuan Zhang (1);  Chao Meng (2);  Yanyan Kong (3)
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kunwar, Anil;  Tonks, Michael R.;  Shang, Shengyan;  Song, Xueguan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
EFAV-MERD: Expected forwarding area volume and residual distance mathematic expectation routing protocol for UASNs 会议论文
10th International Conference on Security, Privacy and Anonymity in Computation, Communication and Storage, SpaCCS 2017, Guangzhou, China, 2017-12-12
作者:  Yu, Haitao;  Wang, Qingwen;  Yao, Nianmin;  Chu, Yan;  Zhou, Maojie
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
An Energy Harvesting Mechanism Transfer Human Walking Energy to Hydraulic Power 会议论文
作者:  Shi, Hu;  Wang, Zheng;  Wang, Haitao;  Mei, Xuesong
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26

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