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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2017    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Effect of sintering method on properties of nanosilver paste 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24 nanosilver  sintering  thermal conductivity  shear strength   Fabrication and Characterization of Graphene Based Film 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Shi, Yuqing[1];  Ye, Lilei[2];  Zehri, Abdel Hafid[3];  Logothetis, Nikolas[4];  Su, Peng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 graphme film  electrospray deposition  film fabrication  flexible film   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   Fabrication of Carbon Nanowalls and its Application in Heat Dissipation 会议论文 Microtechnology and Thermal Problems in Electronics 作者:  Yan Zhang[1];  Shiwei Ma[2];  Jingyu Fan[3];  Aneta Arazna[4];  Kamil Janeczek[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 INVESTIGATION OF THERMAL INTERFACE MATERIALS REINFORCED WITH MICRO- AND NANOPARTICLES 会议论文 China Semiconductor Technology International Conference (CSTIC), 2017-03-12 作者:  Janeczek, Kamil[1];  Arazna, Aneta[2];  Zhang, Yan[3];  Ma, Shiwei[4];  Sitek, Janusz[5] 收藏  |  浏览/下载：14/0  |  提交时间：2019/04/24