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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2014    专题：湖南大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31 Photon-assisted heat generation in a quantum dot device with the charging effect 期刊论文 Journal of Low Temperature Physics, 2014, 卷号: Vol.174 No.43591, 页码: 311-321 作者:  Chen, Qiao;  Zhao, Li-Li;  Wang, Zhi -Yong;  Xie, Zhong -Xiang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31 An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/31 Photon-assisted heat generation in a quantum dot device with the charging effect 期刊论文 Journal of Low Temperature Physics, 2014, 卷号: Vol.174 No.43591, 页码: 311-321 作者:  Chen, Qiao;  Zhao, Li-Li;  Wang, Zhi -Yong;  Xie, Zhong -Xiang 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/31 An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint 期刊论文 Transactions of the China Welding Institution, 2014, 卷号: Vol.35 No.8, 页码: 30-34,42 作者:  Zhao, Huihuang;  Wang, Yaonan;  Sun, Yaqi;  Wei, Shudi 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31 Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: Vol.26 No.3, 页码: 129-138 作者:  Zhao, Huihuang;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31 Photon-Assisted Heat Generation in a Quantum Dot Device with the Charging Effect 期刊论文 JOURNAL OF LOW TEMPERATURE PHYSICS, 2014, 卷号: Vol.174 No.5-6, 页码: 311-321 作者:  Chen, Q;  Zhao, LL;  Wang, ZY;  Xie, ZX 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31 Solder joint imagery compressing and recovery based on compressive sensing 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: Vol.26 No.3, 页码: 129-138 作者:  Zhao, Huihuang;  Wang, Yaonan;  Qiao, Zhijun;  Fu, Bin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/31 Assembly  Pin-in-paste  Solder  Solder joints