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Using an integrated decontamination technique to remove VOCs and attenuate health risks from an e-waste dismantling workshop (EI收录) 期刊论文
Chemical Engineering Journal, 2017, 卷号: 318, 页码: 57-63
作者:  Liu, Ranran[1,3];  Chen, Jiangyao[1,2];  Li, Guiying[1,2];  An, Taicheng[1,2]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/24
An MILP model and a hybrid evolutionary algorithm for integrated operation optimisation of multi-head surface mounting machines in PCB assembly (EI收录) 期刊论文
International Journal of Production Research, 2017, 卷号: 55, 页码: 145-160
作者:  Luo, Jiaxiang[1];  Liu, Jiyin[2];  Hu, Yueming[1]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/24
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) (EI收录) 期刊论文
Journal of the Electrochemical Society, 2017, 卷号: 164
作者:  Xiao, Hongbin[1,2];  Wang, Fuliang[1,2];  Wang, Yan[1,2];  He, Hu[1,2];  Zhu, Wenhui[1,2]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/24
Very small FPGA processor for multivariate signatures (EI收录SCI收录) 期刊论文
Computer Journal, 2016, 卷号: 59, 页码: 1091-1101
作者:  Yi, Haibo[1];  Tang, Shaohua[1]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/24
Differential Evolution Algorithm with Two-Step Subpopulation Strategy and Its Application in Microwave Circuit Designs (EI收录) 期刊论文
IEEE Transactions on Industrial Informatics, 2016, 卷号: 12, 页码: 911-923
作者:  Zheng, Li Ming[1];  Zhang, Sheng Xin[1];  Zheng, Shao Yong[2];  Pan, Yong Mei[3]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/24
Substrate integrated waveguide quasi-elliptic filter using slot-coupled and microstrip-line cross-coupled structures (EI收录) 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 卷号: 6, 页码: 1881-1888
作者:  Wong, Sai-Wai[1];  Chen, Rui-Sen[1];  Lin, Jing-Yu[1];  Zhu, Lei[2];  Chu, Qing-Xin[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/24
Pseudo-CMOS with re-pull-down transistor: A low power inverter design for thin-film transistors (EI收录) 期刊论文
IEICE Transactions on Electronics, 2016, 卷号: E99C, 页码: 727-729
作者:  Zhong, Lihao[1];  Yao, Ruohe[1];  Luo, Fei[2]
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/24
An analytical model of thermal mechanical stress induced by through silicon via (EI收录) 期刊论文
Chinese Physics B, 2015, 卷号: 24
作者:  Dong, Gang[1];  Shi, Tao[1];  Zhao, Ying-Bo[1];  Yang, Yin-Tang[1]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/25
Coupled inductor design with small voltage spike of SEPIC converter (EI收录) 会议论文
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Austin, TX, United states, March 6, 2005 - March 10, 2005
作者:  Deng, WeiHua[1];  Zhang, Bo[2];  Du, GuiPing[3,4];  Hu, ZongBo[1]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/18
Implementation method for voting of neural networks (CPCI-S收录) 会议论文
2004 IEEE INTERNATIONAL CONFERENCE ON COMPUTATIONAL INTELLIGENCE FOR MEASUREMENT SYSTEMS AND APPLICATIONS
作者:  Huang, Q;  Zheng, QL;  Fan, WH
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/18


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