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Fracture strength of silicon wafers sawn by fixed diamond wire saw 期刊论文
SOLAR ENERGY, 2017, 卷号: 157, 页码: 427-433
作者:  Liu, Tengyun;  Ge, Peiqi;  Bi, Wenbo;  Wang, Peizhi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/12
Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2016, 卷号: 87, 期号: 5-8, 页码: 1671-1676
作者:  Ge, Mengran;  Bi, Wenbo;  Ge, Peiqi;  Bi, Yuchao
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/16
Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon 期刊论文
APPLICATION OF DIAMOND AND RELATED MATERIALS, 2011, 卷号: 175, 页码: 72-76
作者:  Gao, Yufei;  Ge, Peiqi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/23
Analysis of grit cut depth in fixed-abrasive diamond wire saw slicing single crystal silicon 期刊论文
Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena, 2011, 页码: 72-76
作者:  Gao, Y.;  Ge, P.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/23
Modification of Resin and its Application to Resin-bonded Diamond Wire Saw Manufacture 期刊论文
SURFACE FINISHING TECHNOLOGY AND SURFACE ENGINEERING II, 2010, 卷号: 135, 页码: 393-397
作者:  Bi, W. B.;  Ge, P. Q.;  Song, S. Q.;  Gao, Y. F.;  Wang, Z. S.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/26
Development of resin bonded diamond wire saw and slicing experiments 期刊论文
Key Engineering Materials, 2009, 卷号: 416, 页码: 321-326
作者:  Ge, Peiqi;  Hou, Zhijian;  Li, Shaojie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/26
Development of Resin Bonded Diamond Wire Saw and Slicing Experiments 期刊论文
Key engineering materials, 2009, 页码: 519-523
作者:  Peiqi Ge;  Zhijian Hou;  Shaojie Li
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/26
Study on removal mechanism of fixed-abrasive diamond wire saw slicing monocrystalline silicon 期刊论文
ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XIV, 2008, 卷号: 359-360, 页码: 450-454
作者:  Gao, Yufei;  Ge, Peiqi;  Hou, Zhijian
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27
The surface quality of monocrystalline silicon cutting using fixed abrasive diamond endless wire saw 期刊论文
International Journal of Computer Applications in Technology, 2007, 卷号: 29, 期号: 43135, 页码: 208-211
作者:  Meng, J.F.;  Ge, P.Q.;  Li, J.F.
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/03
Research on monocrystalline silicon slicing with fixed abrasive diamond wire saw 期刊论文
International Journal of Machining and Machinability of Materials, 2006, 卷号: 1, 期号: 3, 页码: 333-342
作者:  Ge P.;  Meng J.;  Hou Z.
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/03

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