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CORC

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Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces 期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
作者:  Gao, Zhaoqing;  Wang, Chen;  Gao, Nan;  Guo, Shihao;  Chen, Yinbo
收藏  |  浏览/下载：26/0  |  提交时间：2022/07/01
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu
收藏  |  浏览/下载：25/0  |  提交时间：2022/07/14
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：11/0  |  提交时间：2022/07/01
Structure-composition-property correlations of symmetrical tilt grain boundaries in copper-based binary alloys 期刊论文
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2021, 卷号: 154, 页码: 9
作者:  Xue, Hongtao;  Lei, Chao;  Tang, Fuling;  Li, Xiuyan;  Luo, Yaqiao
收藏  |  浏览/下载：55/0  |  提交时间：2021/10/15
Residual stress and precipitation of Mg-5Zn-3.5Sn-1Mn-0.5Ea-0.5Cu alloy with different quenching rates 期刊论文
JOURNAL OF MAGNESIUM AND ALLOYS, 2021, 卷号: 9, 期号: 2, 页码: 604-612
作者:  Wang, Cong;  Luo, Tianjiao;  Liu, Yunteng;  Huang, Qiuyan;  Yang, Yuansheng
收藏  |  浏览/下载：18/0  |  提交时间：2021/10/15
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/03
Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents 期刊论文
COATINGS, 2020, 卷号: 10, 期号: 12
作者:  Cao, Xiaozhou;  Xu, Lulu;  Wang, Chao;  Li, Siyi;  Wu, Dong
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/03
Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65
作者:  Cai, T.;  Li, K. Q.;  Zhang, Z. J.;  Zhang, P.;  Liu, R.
收藏  |  浏览/下载：34/0  |  提交时间：2021/02/02
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02

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