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科研机构
北京航空航天大学 [301]
内容类型
期刊论文 [166]
会议论文 [135]
发表日期
2019 [49]
2018 [53]
2017 [25]
2016 [41]
2015 [42]
2014 [33]
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专题:北京航空航天大学
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A Software Based on Multi-Signal Flow Graph Model for PHM-Oriented Design for Testability
会议论文
Proceedings of the IEEE International Conference on Software Engineering and Service Sciences, ICSESS, 2018-11-23
作者:
Wang, G.
;
Zhang, H.
收藏
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浏览/下载:10/0
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提交时间:2019/12/30
Graph theory
Graphic methods
Safety engineering
Signal flow graphs
Software engineering
Amplifier circuits
Dependency matrix
Design and analysis
Failure test
Fault propagation
Propagation time
Testability
Visual development
Design for testability
Maintenance Optimization of Two-Units System with General Time Distributions
会议论文
Proceedings - 2018 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2018, 2018-08-15
作者:
Li, M.
;
Wang, N.
;
Xiao, B.
;
Ma, L.
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浏览/下载:57/0
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提交时间:2019/12/30
Equations of state
Failure analysis
Markov processes
Numerical methods
Optimization
Systems engineering
Corrective maintenance
Exponential distributions
Maintenance optimization
Preventive maintenance (pm)
Solution methods
Steady-state availability
System maintenance
Time distribution
Preventive maintenance
A Time-Varying Vine Copula Model for Dependence Analysis of Failure System
会议论文
Proceedings - 2018 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2018, 2018-08-15
作者:
Xu, D.
;
Yuan, J.
;
Xing, M.
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/12/30
Systems engineering
Dependence analysis
Failure dependence
High-dimensional
Joint distributions
Multivariate approach
Time-varying models
Time-varying parameter models
vine copula
Failure (mechanical)
Crack initiation and early propagation behavior of AlSi10Mg(Cu) cast alloy under thermal fatigue [AlSi10Mg(Cu)铸铝合金的热疲劳裂纹萌生及早期扩展行为]
期刊论文
Cailiao Gongcheng/Journal of Materials Engineering, 2019, 卷号: 47, 页码: 131-138
作者:
Zhou, H.
;
Zhang, Z.
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浏览/下载:113/0
  |  
提交时间:2019/12/30
Copper alloys
Crack initiation
Failure (mechanical)
Fatigue crack propagation
Thermal expansion
Thermal fatigue
Cast alloys
Early propagation
Eutectic silicon particles
Silicon particles
Simulation analysis
Thermal expansion coefficients
Thermal fatigue cracks
Thermal fatigue loadings
Cracks
Coordinative optimization method of composite laminated structures based on system reliability
期刊论文
STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, 2019, 卷号: 59, 页码: 1483-1501
作者:
Ma, Yujia
;
Wang, Xiaojun
;
Shi, Qinghe
;
Ren, Qiang
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/30
System reliability optimization
Last layer failure criterion
Laminated structures
Hashin failure criterion
Finite element analysis
Thermomechanical fatigue experiment and failure analysis on a nickel-based superalloy turbine blade
期刊论文
ENGINEERING FAILURE ANALYSIS, 2019, 卷号: 102, 页码: 35-45
作者:
Wang, R.
;
Zhang, B.
;
Hu, D.
;
Jiang, K.
;
Liu, H.
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  |  
浏览/下载:25/0
  |  
提交时间:2019/12/30
Thermomechanical fatigue
Nickel-based superalloy
Turbine blade
Failure analysis
Fractography
Metallography
Experimental analysis of operation failure for a neon cryogenic loop heat pipe
期刊论文
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 卷号: 138, 页码: 96-108
作者:
Guo, Yuandong
;
Lin, Guiping
;
He, Jiang
;
Bai, Lizhan
;
Sun, Yue
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  |  
浏览/下载:10/0
  |  
提交时间:2019/12/30
Loop heat pipe
Cryogenic
Supercritical startup
Failure
Impurity gas
The lifetime prediction of epoxy resin adhesive based on small-sample data
期刊论文
ENGINEERING FAILURE ANALYSIS, 2019, 卷号: 102, 页码: 111-122
作者:
Zhu, Yipeng
;
Zhao, Tingdi
;
Jiao, Jian
;
Chen, Zhiwei
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/30
Epoxy resin adhesive
Lifetime prediction
Accelerated degradation test
The three-variate degradation path model
BP neural network
Big Data-Oriented Product Infant Failure Intelligent Root Cause Identification Using Associated Tree and Fuzzy DEA
期刊论文
IEEE ACCESS, 2019, 卷号: 7, 页码: 34687-34698
作者:
He, Zhenzhen
;
He, Yihai
;
Liu, Fengdi
;
Zhao, Yixiao
收藏
  |  
浏览/下载:20/0
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提交时间:2019/12/30
Infant failure
big data
root cause analysis
associated tree
fuzzy DEA
Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 94, 页码: 46-55
作者:
Zhang, Hongqiang
;
Zhao, Zhenyu
;
Zou, Guisheng
;
Wang, Wengan
;
Liu, Lei
收藏
  |  
浏览/下载:56/0
  |  
提交时间:2019/12/30
Sintered Ag
Die attach
High temperature storage
Reliability
Power electronics
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