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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6
作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Study on low temperature brazing of magnesium alloy to aluminum alloy using Sn-xZn solders 期刊论文
MATERIALS & DESIGN, 2012, 卷号: 39, 页码: 14-19
作者:  Wang, Zhi;  Wang, Hongyang;  Liu, Liming
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2012, 卷号: 537, 页码: 286-290
作者:  Ma, H. T.;  Qu, L.;  Huang, M. L.;  Gu, L. Y.;  Zhao, N.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 卷号: 492, 页码: 433-438
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Yanhui;  Wu, C. M. L.;  Wang, Lai
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24
Comparison of corrosion behavior of soldering alloys and joints 会议论文
7th Fracture Mechanics Symposium (FM 2009), SW Jiaotong Univ, Chengdu, PEOPLES R CHINA, 2009-01-01
作者:  Yang, Fen;  Wang, Lihua;  Li, Xiaogang;  Zhao, Jie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24
Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 卷号: 473, 页码: 382-388
作者:  Zhao, Jie;  Cheng, Cong-qian;  Qi, Lin;  Chi, Cheng-yu
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 458, 页码: 542-547
作者:  Yu, D. Q.;  Wang, L.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27

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