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Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu-xPOSS composite solders 期刊论文
2012, 卷号: 23, 页码: 1640-1646
作者:  Shen, Jun[1];  Peng, Changfei[1];  Yin, Heng Gang[1];  Chen, Jie[1,2]
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