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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial Characteristics of 6061/AZ31B Composites in Multi-Pass Rolling 期刊论文 Materials, 2022, 卷号: 15, 期号: 3 作者:  Yang, Haokun;  Li, Yuandong;  Qiu, Jin;  Song, Zhaoxi;  Bi, Guangli 收藏  |  浏览/下载：30/0  |  提交时间：2022/04/21 Aluminum alloys  Magnesium alloys  Plates (structural components)  Rolling  Tensile strength  6061 aluminum alloys  Al 6061  AZ31B magnesium alloys  Bonding layers  Composite plates  Interface organization  Interfacial characteristics  Multi-pass rolling  Recrystallisation  Solid/liquid   Mixing process and nucleation of an Al-Si alloy during controlled diffusion solidification with simultaneous mixing and effect of mixing rate 期刊论文 JOURNAL OF MATERIALS SCIENCE, 2022, 卷号: 57, 期号: 4, 页码: 3018-3040 作者:  Chen, T. J.;  Yang, X. K.;  Xue, H.;  Bi, G. L.;  Zhang, X. Z. 收藏  |  浏览/下载：16/0  |  提交时间：2022/03/01 Aluminum alloys  Casting  Mixtures  Nucleation  Process control  Silicon alloys  Solidification  Controlled diffusion solidification  Growth modes  Mixing process  Mixing rates  Model materials  Nucleation and growth  Nucleation modes  Si alloys  Solidification process  Two-stream   Enhanced Antiwear Property of Cu-Sn-Bi Bimetal Composites with TiB2 under Different Working Conditions 期刊论文 TRIBOLOGY TRANSACTIONS, 2021, 卷号: 65, 期号: 1, 页码: 78-87 作者:  Yang, Dongya;  Li, Zhenyu;  Zhao, Gengrui;  Wang, Honggang;  Ren, Junfang 收藏  |  浏览/下载：34/0  |  提交时间：2021/12/17 TiB2  CuSn10Bi3  powder metallurgy  microstructure  friction and wear   Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Crystal orientation  Deterioration  Electrodes  Substrates  Thermoelectric equipment  Aging treatment  Brittle failures  Cu electrodeposits  Interfacial contact  Isotropic microstructures  Solder joints  Spreadability  Thermo-Electric materials   Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15 Nanoindentation creep behavior of coarse-grained and ultrafine-grained pure magnesium and AZ31 alloy 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 698, 页码: 348-355 作者:  Hu, Jiangjiang;  Zhang, Wei;  Bi, Guangli;  Lu, Jinwen;  Huo, Wangtu 收藏  |  浏览/下载：15/0  |  提交时间：2019/11/15 Nanoindentation  Magnesium and AZ31 alloy  Ultrafine-grained  Creep behavior  Strain rate sensitivity  Creep stress exponent